EP 1382091 A2 20040121 - CONNECTION HOUSING FOR AN ELECTRONIC COMPONENT
Title (en)
CONNECTION HOUSING FOR AN ELECTRONIC COMPONENT
Title (de)
ANSCHLUSSGEHÄUSE FÜR EIN ELEKTRONISCHES BAUELEMENT
Title (fr)
BOITIER DE CONNEXION POUR UN COMPOSANT ELECTRONIQUE
Publication
Application
Priority
- DE 0201280 W 20020408
- DE 10120256 A 20010425
Abstract (en)
[origin: WO02089257A2] The connection housing comprises a base body (1) with lateral walls (2), which extend around the base body on the top and which enclose the component (6) to be inserted as well as inner contacts (8) that are arranged between the component and at least one lateral wall. Polymer protuberances (3) for forming outer contacts (4) are shaped onto the underside. The connection between the inner contacts (8) of the top and the outer contacts (4) of the underside is effected by micro-boreholes (11) that are located underneath the component (6) in the middle area of the base body (1). This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.
IPC 1-7
IPC 8 full level
H01L 23/13 (2006.01); H01R 13/03 (2006.01); H01L 23/04 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H05K 1/11 (2006.01); H01L 23/055 (2006.01); H05K 3/42 (2006.01)
CPC (source: EP KR US)
H01L 23/055 (2013.01 - KR); H01L 23/13 (2013.01 - EP KR US); H01R 13/035 (2013.01 - EP KR US); H05K 1/119 (2013.01 - EP KR US); H05K 3/42 (2013.01 - KR); H05K 5/03 (2013.01 - KR); H01L 23/055 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP KR US); H01L 2224/48227 (2013.01 - EP KR US); H01L 2924/15151 (2013.01 - EP KR US); H05K 3/42 (2013.01 - EP US); H05K 2201/09036 (2013.01 - EP KR US); H05K 2201/09118 (2013.01 - EP KR US); H05K 2201/0949 (2013.01 - EP KR US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02089257 A2 20021107; WO 02089257 A3 20030103; DE 10120256 C1 20021128; EP 1382091 A2 20040121; JP 2004524711 A 20040812; KR 20040015139 A 20040218; US 2004132321 A1 20040708; US 6953892 B2 20051011
DOCDB simple family (application)
DE 0201280 W 20020408; DE 10120256 A 20010425; EP 02732379 A 20020408; JP 2002586443 A 20020408; KR 20037013928 A 20031024; US 47560603 A 20031022