EP 1389347 A1 20040218 - METHOD FOR CONTACTING AN ELECTRICAL COMPONENT WITH A SUBSTRATE COMPRISING A CONDUCTING STRUCTURE
Title (en)
METHOD FOR CONTACTING AN ELECTRICAL COMPONENT WITH A SUBSTRATE COMPRISING A CONDUCTING STRUCTURE
Title (de)
VERFAHREN ZUR KONTAKTIERUNG EINES ELEKTRISCHEN BAUELEMENTES MIT EINEM EINE LEITERSTRUKTUR AUFWEISENDEN SUBSTRAT
Title (fr)
PROCEDE PERMETTANT D'ETABLIR LE CONTACT ENTRE UN COMPOSANT ELECTRIQUE ET UN SUBSTRAT POSSEDANT UNE STRUCTURE CONDUCTRICE
Publication
Application
Priority
- DE 0201254 W 20020405
- DE 10124770 A 20010521
Abstract (en)
[origin: DE10124770C1] Process for contacting an electrical component (2), especially a semiconductor component, to a substrate (1) having a conducting structure (3) comprises applying a connecting unit having a melting point at which the substrate is not damaged between the electrical component and the conducting structure; and melting the connecting unit and solidifying to form a permanent electrically conducting connection. The joining temperature is raised above the glass transition temperature of the substrate so that the substrate plastically deforms with exertion of a pressure on the electrical component and the electrical component is pressed together with the conducting structure into the substrate. Preferred Features: The conducting structure has conductor lines (3) and a contact site. The connecting unit is arranged between a contact of the electrical component and a contact site of the conductor lines.
IPC 1-7
IPC 8 full level
H05K 3/32 (2006.01); H01L 21/60 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP US)
H01L 24/81 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01049 (2013.01 - EP US); H01L 2924/0105 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01322 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); Y10T 156/1002 (2015.01 - EP US); Y10T 156/1089 (2015.01 - EP US)
Citation (search report)
See references of WO 02095816A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
DE 10124770 C1 20021017; CN 1270365 C 20060816; CN 1511343 A 20040707; EP 1389347 A1 20040218; JP 2005514759 A 20050519; US 2004099366 A1 20040527; US 6915945 B2 20050712; WO 02095816 A1 20021128
DOCDB simple family (application)
DE 10124770 A 20010521; CN 02810295 A 20020405; DE 0201254 W 20020405; EP 02729854 A 20020405; JP 2002592182 A 20020405; US 71877503 A 20031121