EP 1390566 A2 20040225 - COMPOSITE MATERIAL AND METHOD FOR PRODUCTION THEREOF

Title (en)

COMPOSITE MATERIAL AND METHOD FOR PRODUCTION THEREOF

Title (de)

MIT EINER DIAMANTSCHICHT ÜBERZOGENER VERBUNDWERKSTOFF UND VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

MATERIAU COMPOSITE ET SON PROCEDE DE REALISATION

Publication

EP 1390566 A2 20040225 (DE)

Application

EP 02740345 A 20020513

Priority

DE 0201710 W 20020513
DE 10124051 A 20010516
DE 10130590 A 20010627

Abstract (en)

[origin: WO02092866A2] The invention relates to a composite material, comprising a hard metal or cermet substrate body, coated with at least one diamond layer. According to the invention, the adhesion of the diamond layer on fine-grained hard metal or cermet substrate bodies may be improved, whereby the C content of the hard metal or cermet substrate body lies between 89 % and 99 %, preferably between 94 % and 99 % of the maximum possible content at which C porosity occurs, or, for hard metal substrate bodies with Co binder, the magnetic saturation polarisation is 89 to 99 %, preferably 94 to 99 % of the maximum saturation polarisation 4 pi sigma max = 2 Co - 2,2 Cr3C2, (Co and Cr3C2 each given in mass % and 4 pi sigma max in mu T . m3 . kg-1).

IPC 1-7

C23C 30/00; C22C 29/08; C22C 1/05

IPC 8 full level

B22F 3/24 (2006.01); C04B 41/87 (2006.01); C22C 1/05 (2006.01); B23B 27/14 (2006.01); C22C 29/08 (2006.01); C23C 16/02 (2006.01); C23C 16/27 (2006.01); C23C 30/00 (2006.01)

CPC (source: EP US)

C22C 1/051 (2013.01 - EP US); C22C 29/08 (2013.01 - EP US); C23C 16/0218 (2013.01 - EP US); C23C 16/271 (2013.01 - EP US); C23C 30/005 (2013.01 - EP US); B22F 2003/241 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP US); B22F 2999/00 (2013.01 - EP US); Y10T 428/30 (2015.01 - EP US)

C-Set (source: EP US)

B22F 2998/10 + B22F 3/24 + C23C 16/00
B22F 2999/00 + B22F 3/24 + B22F 2201/30

Citation (examination)

EP 0251264 A1 19880107 - MITSUBISHI METAL CORP [JP]
US 5716170 A 19980210 - KAMMERMEIER DIRK [DE], et al
US 5955212 A 19990921 - MATSUMOTO YASUSHI [JP], et al
DD 118898 A1 19760320
See also references of WO 02092866A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 02092866 A2 20021121; WO 02092866 A3 20030313; CN 1296518 C 20070124; CN 1463303 A 20031224; EP 1390566 A2 20040225; HU P0302074 A2 20030929; JP 2004529270 A 20040924; US 2004141867 A1 20040722

DOCDB simple family (application)

DE 0201710 W 20020513; CN 02801691 A 20020513; EP 02740345 A 20020513; HU P0302074 A 20020513; JP 2002589729 A 20020513; US 47798103 A 20031117