EP 1393354 A1 20040303 - METHOD AND DEVICE FOR THE THERMAL TREATMENT OF SUBSTRATES
Title (en)
METHOD AND DEVICE FOR THE THERMAL TREATMENT OF SUBSTRATES
Title (de)
VERFAHREN UND VORRICHTUNG ZUM THERMISCHEN BEHANDELN VON SUBSTRATEN
Title (fr)
PROCEDE ET DISPOSITIF POUR EFFECTUER LE TRAITEMENT THERMIQUE DE SUBSTRATS
Publication
Application
Priority
- DE 10125318 A 20010523
- DE 10222879 A 20020523
- EP 0205683 W 20020523
Abstract (en)
[origin: WO02095804A1] The object of the invention is to measure temperature using pyrometers, in a simple and economic way, enabling precise temperature measurement, even for low temperatures. The invention presents a device and method for thermally treating substrates, wherein the substrate is exposed to at least a first and at least a second radiation; the predetermined wavelengths of the first radiation are absorbed between the first radiation source and the substrate; a radiation from the substrate is measured in the predetermined wavelength using a radiation detector arranged on the same side as a second radiation source; the second radiation from the second radiation source is modulated and determined.
IPC 1-7
IPC 8 full level
C23C 16/48 (2006.01); C30B 31/12 (2006.01); C30B 33/02 (2006.01); H01L 21/00 (2006.01); H01L 21/26 (2006.01); H01L 21/31 (2006.01); H05B 3/00 (2006.01)
CPC (source: EP KR US)
C23C 16/481 (2013.01 - EP US); C30B 31/12 (2013.01 - EP US); C30B 33/02 (2013.01 - EP US); H01L 21/324 (2013.01 - KR); H01L 21/67115 (2013.01 - EP US); H01L 21/67248 (2013.01 - EP US); H05B 3/0047 (2013.01 - EP US); H01L 21/67242 (2013.01 - EP US)
Citation (search report)
See references of WO 02095804A1
Citation (examination)
- US 4890245 A 19891226 - YOMOTO MASAHIKO [JP], et al
- EP 0458388 A1 19911127 - IMEC INTER UNI MICRO ELECTR [BE]
- WO 9400744 A1 19940106 - IMEC INTER UNI MICRO ELECTR [BE], et al
- DE 4012615 A1 19911024 - T ELEKTRONIK GMBH AS [DE]
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02095804 A1 20021128; WO 02095804 A8 20030130; CN 1295745 C 20070117; CN 1533588 A 20040929; DE 10222879 A1 20050317; EP 1393354 A1 20040303; JP 2005500674 A 20050106; JP 4518463 B2 20100804; KR 100673663 B1 20070124; KR 20040007599 A 20040124; US 2004185680 A1 20040923; US 2006291834 A1 20061228; US 7056389 B2 20060606; US 7316969 B2 20080108
DOCDB simple family (application)
EP 0205683 W 20020523; CN 02814635 A 20020523; DE 10222879 A 20020523; EP 02743086 A 20020523; JP 2002592170 A 20020523; KR 20037015304 A 20031122; US 44667506 A 20060605; US 47875404 A 20040409