Global Patent Index - EP 1393388 A1

EP 1393388 A1 20040303 - METHOD FOR PRODUCING CONDUCTIVE STRUCTURES BY MEANS OF A PRINTING TECHNIQUE, AND ACTIVE COMPONENTS PRODUCED THEREFROM FOR INTEGRATED CIRCUITS

Title (en)

METHOD FOR PRODUCING CONDUCTIVE STRUCTURES BY MEANS OF A PRINTING TECHNIQUE, AND ACTIVE COMPONENTS PRODUCED THEREFROM FOR INTEGRATED CIRCUITS

Title (de)

VERFAHREN ZUR ERZEUGUNG VON LEITFÄHIGEN STRUKTUREN MITTELS DRUCKTECHNIK SOWIE DARAUS HERGESTELLTE AKTIVE BAUELEMENTE FÜR INTEGRIERTE SCHALTUNGEN

Title (fr)

PROCEDE POUR REALISER DES STRUCTURES CONDUCTRICES PAR UNE TECHNIQUE DE PRESSION, COMPOSANTS ACTIFS AINSI FABRIQUES ET DESTINES A DES CIRCUITS IMPRIMES

Publication

EP 1393388 A1 20040303 (DE)

Application

EP 02726090 A 20020513

Priority

  • DE 0201717 W 20020513
  • DE 10126859 A 20010601

Abstract (en)

[origin: DE10126859A1] The invention relates to a method for producing conductive structures. Said method is characterised in that strip conductors or electrodes are directly or indirectly produced in a conductive layer by means of a printing technique. The inventive method is especially suitable for producing electrodes and strip conductors in simple, fast and cost-effective ways.

[origin: DE10126859A1] Production of conducting structures comprises directly or indirectly forming conducting pathways and/or electrodes in a conducting layer using a printing technique.

IPC 1-7

H01L 51/40

IPC 8 full level

H01L 51/40 (2006.01); H01L 51/52 (2006.01); H05K 3/02 (2006.01); H05K 3/12 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); H01L 51/30 (2006.01)

CPC (source: EP US)

H05K 3/02 (2013.01 - EP US); H05K 3/12 (2013.01 - EP US); H05K 3/1275 (2013.01 - EP US); H10K 50/805 (2023.02 - US); H10K 59/805 (2023.02 - EP); H10K 71/60 (2023.02 - EP US); H10K 71/611 (2023.02 - EP US); H05K 2201/0329 (2013.01 - EP US); H05K 2203/0113 (2013.01 - EP US); H05K 2203/0534 (2013.01 - EP US); H05K 2203/1142 (2013.01 - EP US); H10K 10/462 (2023.02 - EP US); H10K 71/18 (2023.02 - EP US); H10K 71/621 (2023.02 - EP US); H10K 85/1135 (2023.02 - EP US)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

DE 10126859 A1 20021212; EP 1393388 A1 20040303; US 2004209191 A1 20041021; WO 02099908 A1 20021212

DOCDB simple family (application)

DE 10126859 A 20010601; DE 0201717 W 20020513; EP 02726090 A 20020513; US 47923804 A 20040601