EP 1393388 A1 20040303 - METHOD FOR PRODUCING CONDUCTIVE STRUCTURES BY MEANS OF A PRINTING TECHNIQUE, AND ACTIVE COMPONENTS PRODUCED THEREFROM FOR INTEGRATED CIRCUITS
Title (en)
METHOD FOR PRODUCING CONDUCTIVE STRUCTURES BY MEANS OF A PRINTING TECHNIQUE, AND ACTIVE COMPONENTS PRODUCED THEREFROM FOR INTEGRATED CIRCUITS
Title (de)
VERFAHREN ZUR ERZEUGUNG VON LEITFÄHIGEN STRUKTUREN MITTELS DRUCKTECHNIK SOWIE DARAUS HERGESTELLTE AKTIVE BAUELEMENTE FÜR INTEGRIERTE SCHALTUNGEN
Title (fr)
PROCEDE POUR REALISER DES STRUCTURES CONDUCTRICES PAR UNE TECHNIQUE DE PRESSION, COMPOSANTS ACTIFS AINSI FABRIQUES ET DESTINES A DES CIRCUITS IMPRIMES
Publication
Application
Priority
- DE 0201717 W 20020513
- DE 10126859 A 20010601
Abstract (en)
[origin: DE10126859A1] The invention relates to a method for producing conductive structures. Said method is characterised in that strip conductors or electrodes are directly or indirectly produced in a conductive layer by means of a printing technique. The inventive method is especially suitable for producing electrodes and strip conductors in simple, fast and cost-effective ways.
[origin: DE10126859A1] Production of conducting structures comprises directly or indirectly forming conducting pathways and/or electrodes in a conducting layer using a printing technique.
IPC 1-7
IPC 8 full level
H01L 51/40 (2006.01); H01L 51/52 (2006.01); H05K 3/02 (2006.01); H05K 3/12 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); H01L 51/30 (2006.01)
CPC (source: EP US)
H05K 3/02 (2013.01 - EP US); H05K 3/12 (2013.01 - EP US); H05K 3/1275 (2013.01 - EP US); H10K 50/805 (2023.02 - US); H10K 59/805 (2023.02 - EP); H10K 71/60 (2023.02 - EP US); H10K 71/611 (2023.02 - EP US); H05K 2201/0329 (2013.01 - EP US); H05K 2203/0113 (2013.01 - EP US); H05K 2203/0534 (2013.01 - EP US); H05K 2203/1142 (2013.01 - EP US); H10K 10/462 (2023.02 - EP US); H10K 71/18 (2023.02 - EP US); H10K 71/621 (2023.02 - EP US); H10K 85/1135 (2023.02 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
DE 10126859 A1 20021212; EP 1393388 A1 20040303; US 2004209191 A1 20041021; WO 02099908 A1 20021212
DOCDB simple family (application)
DE 10126859 A 20010601; DE 0201717 W 20020513; EP 02726090 A 20020513; US 47923804 A 20040601