EP 1393603 A1 20040303 - METHOD AND DEVICE FOR STRUCTURING PRINTED CIRCUIT BOARDS
Title (en)
METHOD AND DEVICE FOR STRUCTURING PRINTED CIRCUIT BOARDS
Title (de)
VERFAHREN UND EINRICHTUNG ZUR STRUKTURIERUNG VON LEITERPLATTEN
Title (fr)
PROCEDE ET DISPOSITIF POUR STRUCTURER DES CARTES DE CIRCUIT
Publication
Application
Priority
- DE 0201750 W 20020515
- DE 10127357 A 20010606
Abstract (en)
[origin: DE10127357C1] The manufacturing equipment incorporates a table (10) carrying a substrate plate (1). There is a control circuit (9) with connections to first and second lasers (11,21) with lenses (12,23). The light from the lasers (14,24) is directed onto small working areas (3,4) on the plate. The control system may regulate movement of the plate in the x and y directions.
IPC 1-7
IPC 8 full level
B23K 26/00 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); B23K 101/42 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP KR US)
H05K 3/027 (2013.01 - EP US); H05K 3/06 (2013.01 - KR); H05K 3/062 (2013.01 - EP US); H05K 1/0263 (2013.01 - EP US); H05K 1/0265 (2013.01 - EP US); H05K 3/4644 (2013.01 - EP US); H05K 2201/09727 (2013.01 - EP US); H05K 2203/108 (2013.01 - EP US)
Citation (search report)
See references of WO 02100137A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
DE 10127357 C1 20020926; CN 1513285 A 20040714; EP 1393603 A1 20040303; JP 2004527923 A 20040909; KR 20040014547 A 20040214; TW 520625 B 20030211; US 2003000916 A1 20030102; US 6783688 B2 20040831; WO 02100137 A1 20021212
DOCDB simple family (application)
DE 10127357 A 20010606; CN 02811388 A 20020515; DE 0201750 W 20020515; EP 02740352 A 20020515; JP 2003501975 A 20020515; KR 20037015842 A 20031203; TW 91105155 A 20020319; US 7989602 A 20020222