EP 1399602 A1 20040324 - METHOD OF MAKING A NICKEL-COATED COPPER SUBSTRATE AND THIN FILM COMPOSITE CONTAINING THE SAME
Title (en)
METHOD OF MAKING A NICKEL-COATED COPPER SUBSTRATE AND THIN FILM COMPOSITE CONTAINING THE SAME
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES MIT NICKEL ÜBERZOGENEN KUPFERSUBSTRATES UND DIESES ENTHALTENDES DÜNNSCHICHTVERBUNDMATERIAL
Title (fr)
PROCEDE DE FABRICATION D'UN SUBSTRAT EN CUIVRE RECOUVERT DE NICKEL ET COMPOSITE DE FILM MINCE CONTENANT LE MEME
Publication
Application
Priority
IB 0101201 W 20010628
Abstract (en)
[origin: WO03002782A1] The invention relates to a process of preparing a copper/nickel substrate by annealing nickel-coated copper. After the nickel deposition step, a dielectric, such as lead zirconate titanate (PZT), may be deposited onto the substrate by methods known in the art such as sol-gel or vacuum deposition. This invention further relates to thin film composites. These composites comprise a pre-annealed nickel-coated copper substrate and a dielectric such as PZT.
IPC 1-7
IPC 8 full level
B32B 15/04 (2006.01); C23C 14/08 (2006.01); C23C 14/16 (2006.01); C23C 14/58 (2006.01); C23C 26/00 (2006.01); C23C 28/00 (2006.01); H01G 4/30 (2006.01)
CPC (source: EP)
C23C 14/088 (2013.01); C23C 14/16 (2013.01); C23C 14/5806 (2013.01); C23C 28/322 (2013.01); C23C 28/345 (2013.01); C23C 28/3455 (2013.01)
Citation (search report)
See references of WO 03002782A1
Designated contracting state (EPC)
AT BE CH DE FR GB LI
DOCDB simple family (publication)
WO 03002782 A1 20030109; CN 1318646 C 20070530; CN 1466634 A 20040107; EP 1399602 A1 20040324; JP 2004530584 A 20041007
DOCDB simple family (application)
IB 0101201 W 20010628; CN 01811896 A 20010628; EP 01945555 A 20010628; JP 2003508744 A 20010628