EP 1399952 A4 20070321 - OPTO-ELECTRONIC DEVICE INTEGRATION

Title (en)

OPTO-ELECTRONIC DEVICE INTEGRATION

Title (de)

INTEGRATION OPTOELEKTRONISCHER BAUELEMENTE

Title (fr)

INTEGRATION D'UN DISPOSITIF OPTO-ELECTRONIQUE

Publication

EP 1399952 A4 20070321 (EN)

Application

EP 02753370 A 20020628

Priority

US 0222089 W 20020628
US 89618901 A 20010629
US 89715801 A 20010629
US 89716001 A 20010629
US 89698301 A 20010629
US 36599802 P 20020319
US 36599602 P 20020319
US 36603202 P 20020319

Abstract (en)

[origin: WO03003427A1] A method of creating a hybridized chip having at least one top active device coupled to an electronic chip where a top active device is combined with an electronic chip having electronic chip contacts, when at least some of the top active device contacts are not aligned with at least some of the electronic chip contacts, and each of the at least some top active device contacts has an electrically corresponding electronic chip contact. The method involves creating sidewalls defining openings in the substrate, extending from the first side at the active device contacts to the bottom fo the substrate opposite the first side, at points substantially coincident with the active device contacts; making the sidewalls electrically conductive; and connecting the points and the electronic chip contacts with an electrically conductive material.

IPC 8 full level

H04B 10/00 (2006.01); G02B 6/42 (2006.01); H01L 21/68 (2006.01); H01L 25/16 (2006.01); H01L 27/144 (2006.01); H01S 5/02 (2006.01); H01S 5/02375 (2021.01); H01S 5/026 (2006.01); H01S 5/40 (2006.01); H04B 10/24 (2006.01); H01L 27/15 (2006.01); H01S 5/42 (2006.01)

CPC (source: EP KR US)

G02B 6/4204 (2013.01 - EP KR); H01L 21/6835 (2013.01 - EP KR); H01L 24/95 (2013.01 - EP KR); H01L 25/167 (2013.01 - EP KR); H01L 27/144 (2013.01 - EP KR); H01L 27/156 (2013.01 - KR); H01L 31/10 (2013.01 - KR); H01S 5/02375 (2021.01 - EP KR US); G02B 6/4249 (2013.01 - EP KR); G02B 6/4292 (2013.01 - EP KR); H01L 27/156 (2013.01 - EP); H01L 2221/68359 (2013.01 - EP KR); H01L 2221/68363 (2013.01 - EP KR); H01L 2924/01322 (2013.01 - EP KR); H01L 2924/12042 (2013.01 - EP KR); H01L 2924/351 (2013.01 - EP KR); H01S 5/0201 (2013.01 - EP KR); H01S 5/0217 (2013.01 - EP KR); H01S 5/0234 (2021.01 - EP); H01S 5/02345 (2021.01 - EP KR); H01S 5/0237 (2021.01 - EP KR); H01S 5/4087 (2013.01 - EP KR); H01S 5/423 (2013.01 - EP KR)

C-Set (source: EP)

Citation (search report)

[X] US 6075710 A 20000613 - LAU JOHN H [US]
[X] US 4202007 A 19800506 - DOUGHERTY WILLIAM E [US], et al
[A] JP H11163528 A 19990618 - IBIDEN CO LTD
[A] JP 2000307025 A 20001102 - MATSUSHITA ELECTRIC IND CO LTD
[PA] WO 0169675 A1 20010920 - AMERASIA INT TECHNOLOGY INC [US], et al
See references of WO 03003425A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 03003427 A1 20030109; AT E358333 T1 20070415; CA 2447345 A1 20030109; CA 2447365 A1 20030109; CA 2447368 A1 20030109; CA 2447369 A1 20030109; CN 100367584 C 20080206; CN 1274005 C 20060906; CN 1285098 C 20061115; CN 1522459 A 20040818; CN 1522460 A 20040818; CN 1526156 A 20040901; CN 1579002 A 20050209; DE 60219161 D1 20070510; DE 60219161 T2 20071213; EP 1399952 A1 20040324; EP 1399952 A4 20070321; EP 1399953 A1 20040324; EP 1399953 A4 20040901; EP 1399953 B1 20070328; EP 1410424 A1 20040421; EP 1410424 A4 20070321; KR 100918512 B1 20090924; KR 100936525 B1 20100113; KR 100964927 B1 20100625; KR 20040015284 A 20040218; KR 20040015748 A 20040219; KR 20040060855 A 20040706; KR 20040064219 A 20040716; KR 20090082274 A 20090729; WO 03003420 A1 20030109; WO 03003425 A1 20030109; WO 03003426 A1 20030109

DOCDB simple family (application)

US 0222293 W 20020628; AT 02756474 T 20020628; CA 2447345 A 20020628; CA 2447365 A 20020628; CA 2447368 A 20020628; CA 2447369 A 20020628; CN 02813089 A 20020628; CN 02813090 A 20020628; CN 02813097 A 20020628; CN 02813100 A 20020628; DE 60219161 T 20020628; EP 02749716 A 20020628; EP 02753370 A 20020628; EP 02756474 A 20020628; KR 20037016812 A 20020628; KR 20037016813 A 20031223; KR 20037016814 A 20020628; KR 20037016822 A 20031223; KR 20097011845 A 20020628; US 0220695 W 20020628; US 0222089 W 20020628; US 0222291 W 20020628