Global Patent Index - EP 1399955 A1

EP 1399955 A1 20040324 - METHOD FOR PREPARING LOW DIELECTRIC FILMS

Title (en)

METHOD FOR PREPARING LOW DIELECTRIC FILMS

Title (de)

VERFAHREN ZUR HERSTELLUNG VON NIEDRIG-DIELEKTRIKUM-FILMEN

Title (fr)

PROCEDES DE PREPARATION DE FILMS A CONSTANTE DIELECTRIQUE FAIBLE

Publication

EP 1399955 A1 20040324 (EN)

Application

EP 02743932 A 20020628

Priority

  • KR 0201238 W 20020628
  • KR 20010038050 A 20010629

Abstract (en)

[origin: WO03005429A1] A low dielectric constant hydrogenated silicon-oxycarbide (SiCO:H) film is prepared by conducting chemical vapor deposition using, together with an O2-containing gas plasma, an organosilicon or organosilicate compound having at least one vinyl or ethinyl group, or a mixture of a saturated organosilicon or organosilicate compound and an unsaturated hydrocarbon.

IPC 1-7

H01L 21/22

IPC 8 full level

C23C 16/42 (2006.01); C23C 16/30 (2006.01); C23C 16/40 (2006.01); H01L 21/31 (2006.01); H01L 21/312 (2006.01); H01L 21/316 (2006.01); H01L 25/00 (2006.01)

CPC (source: EP KR US)

C23C 16/30 (2013.01 - EP US); C23C 16/401 (2013.01 - EP US); H01L 21/02126 (2013.01 - US); H01L 21/02211 (2013.01 - US); H01L 21/02216 (2013.01 - US); H01L 21/02274 (2013.01 - US); H01L 21/31 (2013.01 - KR); H01L 21/3122 (2013.01 - US); H01L 21/31633 (2013.01 - US); H01L 21/02126 (2013.01 - EP); H01L 21/02167 (2013.01 - EP); H01L 21/02211 (2013.01 - EP); H01L 21/02216 (2013.01 - EP); H01L 21/02274 (2013.01 - EP)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 03005429 A1 20030116; CN 1277290 C 20060927; CN 1522462 A 20040818; EP 1399955 A1 20040324; JP 2004534400 A 20041111; JP 3828540 B2 20061004; KR 20030002993 A 20030109; RU 2004102519 A 20050320; RU 2264675 C2 20051120; TW 571350 B 20040111; US 2004166240 A1 20040826; US 7087271 B2 20060808

DOCDB simple family (application)

KR 0201238 W 20020628; CN 02813172 A 20020628; EP 02743932 A 20020628; JP 2003511297 A 20020628; KR 20020028660 A 20020523; RU 2004102519 A 20020628; TW 91115011 A 20020705; US 48077003 A 20031212