EP 1399957 A2 20040324 - MICROELECTRONIC SUBSTRATE HAVING CONDUCTIVE MATERIAL WITH BLUNT CORNERED APERTURES, AND ASSOCIATED METHODS FOR REMOVING CONDUCTIVE MATERIAL
Title (en)
MICROELECTRONIC SUBSTRATE HAVING CONDUCTIVE MATERIAL WITH BLUNT CORNERED APERTURES, AND ASSOCIATED METHODS FOR REMOVING CONDUCTIVE MATERIAL
Title (de)
MIKROELEKTRONISCHES SUBSTRAT MIT LEITENDEM MATERIAL MIT ABGERUNDETEN ÖFFNUNGEN UND METHODEN ZUR ENTFERNUNG VON LEITENDEN MATERIAL
Title (fr)
SUBSTRAT MICRO-ELECTRONIQUE COMPORTANT UN MATERIAU CONDUCTEUR A OUVERTURES AVEC COINS EMOUSSES, ET PROCEDES CORRESPONDANTS PERMETTANT D'ENLEVER LE MATERIAU CONDUCTEUR
Publication
Application
Priority
- US 0219496 W 20020620
- US 88776701 A 20010621
- US 88808401 A 20010621
- US 88800201 A 20010621
Abstract (en)
[origin: WO03001581A2] A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad,electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential,and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate, disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid, and movingat least one of the microelectronic and the polishing pad relative to the other.
IPC 1-7
IPC 8 full level
B24B 37/04 (2006.01); C25F 3/14 (2006.01); H01L 21/3063 (2006.01); H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01); H01L 21/76 (2006.01); H01L 21/762 (2006.01)
CPC (source: EP KR)
B24B 37/046 (2013.01 - EP); C25F 3/30 (2013.01 - EP); C25F 5/00 (2013.01 - EP); C25F 7/00 (2013.01 - EP); H01L 21/3063 (2013.01 - KR); H01L 21/32125 (2013.01 - EP)
Citation (search report)
See references of WO 03001582A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 03001581 A2 20030103; WO 03001581 A3 20031030; AU 2002316303 A1 20030108; CN 100356523 C 20071219; CN 1516894 A 20040728; EP 1399956 A2 20040324; EP 1399957 A2 20040324; JP 2004531649 A 20041014; JP 2004531899 A 20041014; JP 4446271 B2 20100407; KR 100598477 B1 20060711; KR 100663662 B1 20070103; KR 20040010773 A 20040131; KR 20040021616 A 20040310; WO 03001582 A2 20030103; WO 03001582 A3 20031030
DOCDB simple family (application)
US 0219495 W 20020620; AU 2002316303 A 20020620; CN 02812238 A 20020620; EP 02744464 A 20020620; EP 02746596 A 20020620; JP 2003507878 A 20020620; JP 2003507879 A 20020620; KR 20037016756 A 20031222; KR 20037016758 A 20031222; US 0219496 W 20020620