EP 1400567 B1 20060308 - Thermosetting resin composition, epoxy resin molding material and semiconductor device
Title (en)
Thermosetting resin composition, epoxy resin molding material and semiconductor device
Title (de)
Thermoreaktive Harzzusammensetzung, Epoxy-Harz Formmasse und Halbleitergerät
Title (fr)
Composition de resin epoxy et semiconducteur
Publication
Application
Priority
- EP 02020845 A 20020918
- CN 02143517 A 20020927
- US 25499002 A 20020925
Abstract (en)
[origin: EP1400567A1] An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. <CHEM> <CHEM> (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divalent organic group having 1 to 13 carbon atoms and 0</=m<</=0.75.)
IPC 8 full level
C08G 59/62 (2006.01); C08G 59/68 (2006.01); C08K 5/13 (2006.01); C08K 5/50 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP US)
C08G 59/621 (2013.01 - EP US); C08G 59/688 (2013.01 - EP US); C08K 5/50 (2013.01 - EP US); H01L 23/293 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10T 428/287 (2015.01 - EP US); Y10T 428/31511 (2015.04 - EP US)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 1400567 A1 20040324; EP 1400567 B1 20060308; US 2004058160 A1 20040325; US 6753086 B2 20040622
DOCDB simple family (application)
EP 02020845 A 20020918; US 25499002 A 20020925