EP 1401641 A4 20071212 - INTERFACE MATERIALS AND METHODS OF PRODUCTION AND USE THEREOF

Title (en)

INTERFACE MATERIALS AND METHODS OF PRODUCTION AND USE THEREOF

Title (de)

GRENZFLÄCHENMATERIALIEN UND HERSTELLUNGSVERFAHREN UND VERWENDUNG DAVON

Title (fr)

MATERIAUX D'INTERFACE ET LEURS PROCEDES DE PRODUCTION ET D'UTILISATION

Publication

EP 1401641 A4 20071212 (EN)

Application

EP 02729331 A 20020530

Priority

US 0217331 W 20020530
US 29443301 P 20010530
US 4761702 A 20020114

Abstract (en)

[origin: WO02096636A1] Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.

IPC 1-7

B32B 5/12; B32B 5/06; B05D 5/12; B05D 1/14; B05D 1/16; D04H 11/00; D04H 1/04

IPC 8 full level

B32B 5/00 (2006.01); B32B 7/02 (2006.01); B32B 27/12 (2006.01); D04H 13/00 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); F28D 20/02 (2006.01)

CPC (source: EP KR US)

B32B 5/12 (2013.01 - KR); B32B 7/12 (2013.01 - US); B32B 25/10 (2013.01 - US); B32B 27/12 (2013.01 - EP US); B32B 27/20 (2013.01 - US); B32B 27/42 (2013.01 - US); H01L 23/4275 (2013.01 - EP); H01L 23/433 (2013.01 - EP); B32B 2038/0076 (2013.01 - US); B32B 2262/103 (2013.01 - US); B32B 2262/106 (2013.01 - US); B32B 2319/00 (2013.01 - US); B32B 2405/00 (2013.01 - US); F28D 20/02 (2013.01 - EP); F28F 2013/006 (2013.01 - EP); H01L 2224/16 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2924/00014 (2013.01 - EP); H01L 2924/01019 (2013.01 - EP); H01L 2924/01057 (2013.01 - EP); H01L 2924/01078 (2013.01 - EP); H01L 2924/01079 (2013.01 - EP); H01L 2924/09701 (2013.01 - EP); H01L 2924/12044 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H01L 2924/16152 (2013.01 - EP); H01L 2924/3011 (2013.01 - EP)

C-Set (source: EP)

Citation (search report)

[X] WO 9967811 A2 19991229 - JOHNSON MATTHEY ELECT INC [US]
[A] US 5489637 A 19960206 - NGUYEN MY N [US], et al
[A] EP 1039537 A2 20000927 - POLYMATECH CO LTD [JP]
[A] WO 0033628 A1 20000608 - INTEL CORP [US], et al
See references of WO 02096636A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 02096636 A1 20021205; CA 2433637 A1 20021205; CN 1267268 C 20060802; CN 1512933 A 20040714; EP 1401641 A1 20040331; EP 1401641 A4 20071212; JP 2005508767 A 20050407; JP 4237505 B2 20090311; KR 20040002866 A 20040107; TW I286514 B 20070911

DOCDB simple family (application)

US 0217331 W 20020530; CA 2433637 A 20020530; CN 02811103 A 20020530; EP 02729331 A 20020530; JP 2002593135 A 20020530; KR 20037010597 A 20030812; TW 91111709 A 20020531