EP 1402565 A2 20040331 - HOLDING DEVICE FOR WAFERS
Title (en)
HOLDING DEVICE FOR WAFERS
Title (de)
HALTEVORRICHTUNG FÜR WAFER
Title (fr)
DISPOSITIF DE MAINTIEN POUR DES PLAQUETTES DE SEMI-CONDUCTEUR
Publication
Application
Priority
- DE 0201370 W 20020412
- DE 10121115 A 20010428
Abstract (en)
[origin: WO02089183A2] The invention relates to a holding device for wafers in a system for inspecting wafers. The holding device comprises two grippers (11, 12), which each enclose a partial section of the wafer periphery when the holding device (8) is closed, and which are connected to a drive device (27). When the grippers (11, 12) are controlled, they move away from one another in order to open the holding device (8) and move toward one another in order to close the holding device (8). The holding device also comprises a holding arm (13) on which both grippers (11, 12) are pivotally mounted. The holding arm (13) is mounted in a manner that permits it to rotate about an axis (A) located, in essence, inside the plane formed by the wafer (W) so that a wafer (W) held between the grippers (11, 12) is turned when the holding arm is rotated 180 DEG about the axis (A).
IPC 1-7
IPC 8 full level
B65G 49/07 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP KR US)
H01L 21/68 (2013.01 - KR); H01L 21/68707 (2013.01 - EP US); Y10S 294/902 (2013.01 - EP US)
Citation (search report)
See references of WO 02089183A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02089183 A2 20021107; WO 02089183 A3 20040129; DE 10121115 A1 20021031; EP 1402565 A2 20040331; JP 2004524709 A 20040812; KR 20030095952 A 20031224; TW 550684 B 20030901; US 2003175106 A1 20030918; US 6918735 B2 20050719
DOCDB simple family (application)
DE 0201370 W 20020412; DE 10121115 A 20010428; EP 02740254 A 20020412; JP 2002586385 A 20020412; KR 20027016874 A 20021211; TW 91108078 A 20020419; US 36279103 A 20030225