Global Patent Index - EP 1403034 B1

EP 1403034 B1 20071017 - Corrugated board manufacturing system

Title (en)

Corrugated board manufacturing system

Title (de)

Wellpappe-Anlage

Title (fr)

Système pour la fabrication de carton ondulé

Publication

EP 1403034 B1 20071017 (DE)

Application

EP 03015419 A 20030709

Priority

DE 10245264 A 20020927

Abstract (en)

[origin: EP1403034A2] Corrugated cardboard system for producing multilayered corrugated cardboard comprises at least one production device (1, 2) for producing at least one corrugated cardboard web (3, 4) having outward-protruding corrugation peaks (39) that is laminated on one side, at least one abrasive device (42A, 43A) arranged downstream of the production device in a production direction (31) for evening out the surface of the corrugation peaks, a feed device (15) for feeding a material web, and at least one joining device (32) arranged downstream of the abrasive device for joining the corrugated cardboard web to the material web. An Independent claim is also included for the production of multilayered corrugated cardboard. Preferred Features: The abrasive device has an abrasive body with an abrasive surface.

IPC 8 full level

B31F 1/28 (2006.01)

CPC (source: EP)

B31F 1/2813 (2013.01); B31F 1/2822 (2013.01)

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DOCDB simple family (publication)

EP 1403034 A2 20040331; EP 1403034 A3 20050413; EP 1403034 B1 20071017; AT E375858 T1 20071115; DE 10245264 A1 20040401; DE 50308403 D1 20071129

DOCDB simple family (application)

EP 03015419 A 20030709; AT 03015419 T 20030709; DE 10245264 A 20020927; DE 50308403 T 20030709