EP 1405937 B1 20060726 - POLYESTER BASED THERMALLY ADHESIVE COMPOSITE SHORT FIBER
Title (en)
POLYESTER BASED THERMALLY ADHESIVE COMPOSITE SHORT FIBER
Title (de)
THERMOADHÄSIVE VERBUNDKURZFASER AUF POLYESTERBASIS
Title (fr)
FIBRE COURTE POUR COMPOSITE THERMO-ADHESIF A BASE DE POLYESTER
Publication
Application
Priority
- JP 0202694 W 20020320
- JP 2001105623 A 20010404
Abstract (en)
[origin: WO02081794A1] A polyester based thermally adhesive composite short fiber which comprises an amorphous polyester having a glass transition temperature of 50 to 100 DEG C and no crystal melting point as a thermally adhesive component and a polyalkylene terephthalate having a melting point of 220 DEG C or higher as a fiber forming component, and has a number of crimp of 3 to 40/25 mm, a percentage of crimp of 3 to 40 % and a percentage of shrinkage of web area of 20 % or less, the percentage of shrinkage of web area (%) being represented by (A0 - A1)/A0 X 100 when, after a card web non-woven fabric being composed of the polyester based thermally adhesive composite short fiber alone and having an area of A0 and a METSUKE of 30 g/m<2> is allowed to stand in a hot air dryer kept at 150 DEG C for 2 minutes, the card web non-woven fabric has an area of A1. The polyester based thermally adhesive composite short fiber can be used for manufacturing a high quality fiber structure exhibiting good dimensional stability and being less susceptible to deformation even when used in a high temperature atmosphere.
IPC 8 full level
D01F 8/14 (2006.01); D01D 5/22 (2006.01); D01F 11/08 (2006.01); D02G 1/12 (2006.01); D02J 1/22 (2006.01); D04H 1/541 (2012.01); D04H 1/55 (2012.01); D06M 15/507 (2006.01); D06M 15/53 (2006.01)
CPC (source: EP KR US)
D01F 8/14 (2013.01 - EP KR US); D06M 15/507 (2013.01 - EP US); D06M 15/53 (2013.01 - EP US); Y10T 428/2907 (2015.01 - EP US); Y10T 428/2909 (2015.01 - EP US); Y10T 428/2929 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1405937 A1 20040407; EP 1405937 A4 20051109; EP 1405937 B1 20060726; AT E334240 T1 20060815; CA 2421709 A1 20030307; CA 2421709 C 20090120; CN 1229530 C 20051130; CN 1460136 A 20031203; DE 60213418 D1 20060907; DE 60213418 T2 20070215; HK 1058952 A1 20040611; JP 2002302833 A 20021018; JP 3778808 B2 20060524; KR 100510156 B1 20050825; KR 20030005134 A 20030115; TW 591140 B 20040611; US 2003134115 A1 20030717; WO 02081794 A1 20021017
DOCDB simple family (application)
EP 02705398 A 20020320; AT 02705398 T 20020320; CA 2421709 A 20020320; CN 02801064 A 20020320; DE 60213418 T 20020320; HK 04101755 A 20040310; JP 0202694 W 20020320; JP 2001105623 A 20010404; KR 20027016303 A 20020320; TW 91106723 A 20020403; US 31226002 A 20021224