Global Patent Index - EP 1406827 B1

EP 1406827 B1 20051207 - DEVICE FOR CUTTING THROUGH AN ADHESIVE STRIP AND METHOD FOR PREPARING AN ADHERING LOCATION

Title (en)

DEVICE FOR CUTTING THROUGH AN ADHESIVE STRIP AND METHOD FOR PREPARING AN ADHERING LOCATION

Title (de)

VORRICHTUNG ZUM DURCHTRENNEN EINES KLEBEBANDES UND VERFAHREN ZUR VORBEREITUNG EINER KLEBESTELLE

Title (fr)

DISPOSITIF POUR SECTIONNER UNE BANDE ADHESIVE ET PROCEDE POUR PREPARER UN EMPLACEMENT DE COLLAGE

Publication

EP 1406827 B1 20051207 (DE)

Application

EP 02754367 A 20020716

Priority

  • DE 0202598 W 20020716
  • DE 10135180 A 20010719

Abstract (en)

[origin: WO03008310A1] The invention relates to a device (08) for cutting through an adhesive strip (06) which, on at least one side, is provided with an adhesive layer (11) that is covered by a covering strip (12). Said device comprises a conveying unit (04, 18) by means of which the adhesive strip (06) can be conveyed into an adhering zone (09), and comprises a cutting implement (21) with which the adhesive strip (06) can be cut through in a cutting zone (19). The cutting implement (21) is designed whereby enabling the adhesive strip (06) to be cut through while preserving a connection of the covering strip (12), which rests on the adhesive strip, over the cutting zone (19). The invention also relates to a method for preparing an adhering location.

IPC 1-7

B65H 19/10

IPC 8 full level

B65H 19/10 (2006.01)

CPC (source: EP)

B65H 19/102 (2013.01); B65H 2301/4148 (2013.01); B65H 2301/4607 (2013.01); B65H 2301/51512 (2013.01); B65H 2301/5152 (2013.01); B65H 2301/5153 (2013.01); B65H 2701/1722 (2013.01); B65H 2701/1726 (2013.01); B65H 2701/3772 (2013.01)

Citation (examination)

EP 1041131 A1 20001004 - TSUJIDEN CO LTD [JP]

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

WO 03008310 A1 20030130; AT E312039 T1 20051215; DE 10135180 A1 20030206; DE 50205210 D1 20060112; EP 1406827 A1 20040414; EP 1406827 B1 20051207

DOCDB simple family (application)

DE 0202598 W 20020716; AT 02754367 T 20020716; DE 10135180 A 20010719; DE 50205210 T 20020716; EP 02754367 A 20020716