Global Patent Index - EP 1407830 A2

EP 1407830 A2 20040414 - Segmented die for applying hot melt adhesives or other polymer melts

Title (en)

Segmented die for applying hot melt adhesives or other polymer melts

Title (de)

Segmentierte Düse zum Auftragen von Heissschmelzklebern oder anderen Polymerschmelzen

Title (fr)

Buse segmentée d'application d'adhésifs thermofusibles ou d'autres polymères fondus

Publication

EP 1407830 A2 20040414 (EN)

Application

EP 03079172 A 19990312

Priority

  • EP 99911359 A 19990312
  • US 7778098 P 19980313
  • US 13803998 A 19980820

Abstract (en)

A segmented die assembly (10) comprising a plurality of side-by-side and separate units (15). Each die unit, includes a manifold segment (11) and a die module (12) mounted thereon. The manifold segments (11) are interconnected and function to deliver process air and polymer melt to the modules (12). Each module (12) including a nozzle (13) through which the polymer melt is extruded forming a row of filament(s) (14). The filaments (14) from the array of modules (12) are deposited on a substrate or collector. The die assembly is preferably used to apply a hot melt adhesive to a substrate, but also may be used to produce meltblown webs. <IMAGE>

IPC 1-7

B05C 5/02; B05B 7/08; D01D 4/02; D01D 5/098

IPC 8 full level

B05B 7/08 (2006.01); B05C 5/02 (2006.01); D01D 4/02 (2006.01); D01D 5/098 (2006.01)

CPC (source: EP)

B05B 7/0861 (2013.01); B05C 5/001 (2013.01); B05C 5/0279 (2013.01); D01D 4/025 (2013.01); D01D 5/0985 (2013.01); B05C 5/0237 (2013.01)

Citation (applicant)

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

EP 1407830 A2 20040414; EP 1407830 A3 20041103

DOCDB simple family (application)

EP 03079172 A 19990312