EP 1408882 B1 20090211 - METHOD OF CUTTING MATERIAL FOR USE IN IMPLANTABLE MEDICAL DEVICE
Title (en)
METHOD OF CUTTING MATERIAL FOR USE IN IMPLANTABLE MEDICAL DEVICE
Title (de)
SCHNEIDEVERFAHREN FÜR MATERIALIEN ZUR VERWENDUNG IN MEDIZINISCHEN IMPLANTATEN
Title (fr)
PROCEDE DE DECOUPE DE MATERIAU UTILISE DANS UN DISPOSITIF MEDICAL IMPLANTABLE
Publication
Application
Priority
- US 0223904 W 20020726
- US 30826801 P 20010726
Abstract (en)
[origin: WO03009785A1] A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.
IPC 8 full level
A61F 2/24 (2006.01); B23K 26/32 (2006.01); B23K 26/40 (2006.01)
CPC (source: EP)
A61F 2/2415 (2013.01); B23K 26/32 (2013.01); B23K 26/324 (2013.01); B23K 26/40 (2013.01); B23K 2103/16 (2018.08); B23K 2103/30 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
WO 03009785 A1 20030206; AT E422345 T1 20090215; CA 2455522 A1 20030206; CA 2455522 C 20091208; CA 2666665 A1 20030206; DE 60231122 D1 20090326; EP 1408882 A1 20040421; EP 1408882 B1 20090211; ES 2321590 T3 20090609
DOCDB simple family (application)
US 0223904 W 20020726; AT 02748256 T 20020726; CA 2455522 A 20020726; CA 2666665 A 20020726; DE 60231122 T 20020726; EP 02748256 A 20020726; ES 02748256 T 20020726