EP 1410047 B1 20070228 - MICROMECHANICAL COMPONENT
Title (en)
MICROMECHANICAL COMPONENT
Title (de)
MIKROMECHANISCHES BAUELEMENT
Title (fr)
COMPOSANT MICROMECANIQUE
Publication
Application
Priority
EP 0108674 W 20010726
Abstract (en)
[origin: WO03010545A1] The invention relates to a micromechanical component comprising a substrate (12) and a structural element (2) that is placed on the substrate (12) in a manner that permits it to be displaced. The structural element (2) has a first electrode (24) and a second electrode (26) that is electrically insulated from the first electrode (24). The substrate (12) has a third electrode (28) that is at least partially situated opposite the first electrode (24) and the second electrode (26).
IPC 8 full level
G01P 15/125 (2006.01); B81B 3/00 (2006.01); G01P 15/00 (2006.01); G01P 15/08 (2006.01); G01P 15/18 (2013.01); G02B 26/08 (2006.01); G02B 26/10 (2006.01); G02B 6/12 (2006.01); G02B 6/35 (2006.01)
CPC (source: EP US)
B81B 3/0021 (2013.01 - EP US); B81B 3/004 (2013.01 - EP US); G01P 15/0802 (2013.01 - EP US); G01P 15/0888 (2013.01 - EP US); G01P 15/125 (2013.01 - EP US); G01P 15/18 (2013.01 - EP US); G02B 26/0841 (2013.01 - EP US); G02B 26/101 (2013.01 - EP US); B81B 2201/0235 (2013.01 - EP US); B81B 2201/0242 (2013.01 - EP US); B81B 2201/042 (2013.01 - EP US); B81B 2203/0109 (2013.01 - EP US); B81B 2203/04 (2013.01 - EP US); B81B 2203/058 (2013.01 - EP US); G02B 6/3512 (2013.01 - EP US); G02B 6/357 (2013.01 - EP US); G02B 2006/12104 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 03010545 A1 20030206; AT E355530 T1 20060315; DE 50112140 D1 20070412; EP 1410047 A1 20040421; EP 1410047 B1 20070228; US 2004183149 A1 20040923; US 7078778 B2 20060718
DOCDB simple family (application)
EP 0108674 W 20010726; AT 01971787 T 20010726; DE 50112140 T 20010726; EP 01971787 A 20010726; US 48528404 A 20040126