EP 1410446 A1 20040421 - OPTICAL SEMICONDUCTOR HOUSING WITH TRANSPARENT CHIP AND METHOD FOR MAKING SAME
Title (en)
OPTICAL SEMICONDUCTOR HOUSING WITH TRANSPARENT CHIP AND METHOD FOR MAKING SAME
Title (de)
OPTISCHES HALBLEITERGEHÄUSE MIT TRANSPARENTEM CHIP UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
BOITIER SEMI-CONDUCTEUR OPTIQUE A PASTILLE TRANSPARENTE ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- FR 0104143 W 20011221
- FR 0017264 A 20001229
Abstract (en)
[origin: WO02054497A1] The invention concerns an optical semiconductor housing and the method for making it, comprising a semiconductor component (6) whereof a rear surface is fixed on a front surface of a mounting and electrical connection support (2) and a front face comprises an optical sensor (9), means (11) electrically connecting said semiconductor component to said support, a transparent chip (12) arranged in front of said semiconductor component, which extends at least in front of said optical sensor, and encapsulating means (21) including a coating material which encloses, in front of said support, the periphery of said semiconductor component and said chip, without covering at least the central part of the front surface of said chip.
IPC 1-7
IPC 8 full level
H01L 31/0203 (2014.01)
CPC (source: EP US)
H01L 31/0203 (2013.01 - EP US); H01L 24/73 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/1815 (2013.01 - EP US)
Citation (search report)
See references of WO 02054497A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 02054497 A1 20020711; EP 1410446 A1 20040421; FR 2819103 A1 20020705; FR 2819103 B1 20031212; US 2005082490 A1 20050421; US 7214996 B2 20070508
DOCDB simple family (application)
FR 0104143 W 20011221; EP 01990608 A 20011221; FR 0017264 A 20001229; US 48201704 A 20041122