EP 1411557 A3 20070523 - LED with a wavelength conversion element for car use
Title (en)
LED with a wavelength conversion element for car use
Title (de)
LED mit einem Wellenlängen-Konverter für Autos
Title (fr)
LED avec un convertisseur de longueur d'onde optique pour des voitures
Publication
Application
Priority
JP 2002301931 A 20021016
Abstract (en)
[origin: EP1411557A2] Wavelength conversion element for car use constituted in the following manner can provide practical LED components for headlights and fog lamps. The element comprises a heat conductive base having a cavity; one or more chips fitted to the cavity bottom, and a wavelength conversion part, which converts emitted light from the chip to visible rays, arranged above the chip. The chip comprises a substrate and a light emitting part constituted by an n-type GaN film, an active layer and a p-type GaN film successively laminated on the substrate. The chip has one straight side in its plan view; an angle formed between the bottom and the side cavity surface is over 0 degree and below 90 degree. The cavity has one straight side in its opening. A ratio of the cavity opening to the totaled areas in plan view of the respective chips, is set less than three.
[origin: EP1411557A2] A wavelength conversion element comprises chips (T) fitted to cavity (E) bottom of heat conductive base and a wavelength conversion part (F) which converts a parts or total emitted light from chips to visible rays arranged above chips. The chip is light emitting semiconductor, has active layer and straight side in its plan view such that an acute angle is formed between the bottom and side surface of cavity. The cavity has a straight side in its opening. The ratio of the opening of cavity to the total areas of respective chips in the plan view is set to less than three. The chip is a junction down type chip including a flip chip type chip.
IPC 8 full level
F21S 8/10 (2006.01); H01L 33/32 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); F21W 101/10 (2006.01); F21Y 105/00 (2006.01)
CPC (source: EP US)
H01L 33/20 (2013.01 - EP US); H01L 33/505 (2013.01 - EP US); H01L 33/60 (2013.01 - EP US)
Citation (search report)
- [X] JP H10107325 A 19980424 - NICHIA KAGAKU KOGYO KK
- [DY] JP H0799345 A 19950411 - NICHIA KAGAKU KOGYO KK
- [Y] US 3780357 A 19731218 - HAITZ R
- [Y] JP H07211943 A 19950811 - NIKON CORP
- [A] EP 0415640 A2 19910306 - HEWLETT PACKARD CO [US]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated extension state (EPC)
AL LT LV MK
DOCDB simple family (publication)
EP 1411557 A2 20040421; EP 1411557 A3 20070523; EP 1411557 B1 20140507; CN 100380689 C 20080409; CN 1497745 A 20040519; JP 2004140090 A 20040513; JP 4143732 B2 20080903; US 2004076016 A1 20040422; US 6855958 B2 20050215
DOCDB simple family (application)
EP 03022027 A 20031001; CN 200310101337 A 20031015; JP 2002301931 A 20021016; US 68269703 A 20031009