EP 1412980 A1 20040428 - ELECTRONIC ASSEMBLY INCLUDING A DIE HAVING AN INTEGRATED CIRCUIT AND A LAYER OF DIAMOND AND METHODS OF PRODUCING THE SAME
Title (en)
ELECTRONIC ASSEMBLY INCLUDING A DIE HAVING AN INTEGRATED CIRCUIT AND A LAYER OF DIAMOND AND METHODS OF PRODUCING THE SAME
Title (de)
ELEKTRONISCHES BAUELEMENT MIT EINEM CHIP MIT EINER INTEGRIERTEN SCHALTUNG UND EINER SCHICHT AUS DIAMANT UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
ASSEMBLAGE ELECTRONIQUE COMPRENANT UNE MATRICE CONTENANT UN CIRCUIT INTEGRE ET UNE COUCHE DE DIAMANT ET PROCEDES DE FABRICATION ASSOCIES
Publication
Application
Priority
- US 0224441 W 20020731
- US 92027501 A 20010731
Abstract (en)
[origin: US2003025198A1] Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
IPC 1-7
IPC 8 full level
H01L 23/34 (2006.01); H01L 21/20 (2006.01); H01L 21/762 (2006.01); H01L 23/373 (2006.01)
CPC (source: EP KR US)
H01L 21/20 (2013.01 - KR); H01L 21/2007 (2013.01 - EP US); H01L 21/6835 (2013.01 - EP US); H01L 21/76254 (2013.01 - EP US); H01L 23/3732 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 2221/68354 (2013.01 - EP US); H01L 2221/68359 (2013.01 - EP US); H01L 2224/05568 (2013.01 - EP US); H01L 2224/05573 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/274 (2013.01 - EP US); H01L 2224/73253 (2013.01 - EP US); H01L 2224/81001 (2013.01 - EP US); H01L 2224/8121 (2013.01 - EP US); H01L 2224/81815 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US)
Citation (search report)
See references of WO 03012864A1
Citation (examination)
US 6013563 A 20000111 - HENLEY FRANCOIS J [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
US 2003025198 A1 20030206; US 6770966 B2 20040803; CN 1539166 A 20041020; EP 1412980 A1 20040428; JP 2004537860 A 20041216; JP 4761708 B2 20110831; KR 100612166 B1 20060814; KR 20040017844 A 20040227; TW 200822325 A 20080516; TW I303474 B 20081121; US 2004157386 A1 20040812; US 2005130362 A1 20050616; US 2006270135 A1 20061130; US 6921706 B2 20050726; US 7170098 B2 20070130; US 7432532 B2 20081007; WO 03012864 A1 20030213
DOCDB simple family (application)
US 92027501 A 20010731; CN 02815215 A 20020731; EP 02752655 A 20020731; JP 2003517941 A 20020731; KR 20047001421 A 20020731; TW 96143145 A 20020801; US 0224441 W 20020731; US 49693406 A 20060731; US 5090205 A 20050203; US 77387904 A 20040206