EP 1412983 A2 20040428 - ELECTRONIC DEVICE AND RELATIVE FABRICATION METHOD
Title (en)
ELECTRONIC DEVICE AND RELATIVE FABRICATION METHOD
Title (de)
ELEKTRONIKBAUTEIL UND SEINE HERSTELLUNG
Title (fr)
DISPOSITIF ELECTRONIQUE ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- IT 0200367 W 20020605
- IT TO20010540 A 20010605
Abstract (en)
[origin: WO02099883A2] There is described a three-dimensional electronic device (9) having a number of integrated electronic circuits (1) stacked and forming respective gaps in which are deposited an absorbent material (10) and a liquid impregnating the absorbent material (10). The integrated electronic circuits (1) are enclosed in a hermetic package (7); and, during operation of the electronic device (9), the heat produced by the integrated electronic circuits (1) causes the liquid to evaporate, the vapor comes into contact with, and transfers heat to, the walls of the package (7), and, on cooling, condenses once more to the liquid state, which, by virtue of the capillarity of the absorvent material (10), is brought once more into contact with the integrated electronic circuits (1).
IPC 1-7
H01L 25/065; H01L 25/16; H01L 21/98; H01L 23/34; H01L 23/427
IPC 8 full level
H01L 23/373 (2006.01); H01L 23/427 (2006.01); H01L 25/065 (2006.01)
CPC (source: EP)
H01L 23/3733 (2013.01); H01L 23/427 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/0002 (2013.01)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02099883 A2 20021212; WO 02099883 A3 20040304; AU 2002314532 A1 20021216; EP 1412983 A2 20040428; IT TO20010540 A0 20010605; IT TO20010540 A1 20021205
DOCDB simple family (application)
IT 0200367 W 20020605; AU 2002314532 A 20020605; EP 02741171 A 20020605; IT TO20010540 A 20010605