Global Patent Index - EP 1419525 A2

EP 1419525 A2 20040519 - STRIP CONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A STRIP CONDUCTOR ARRANGEMENT

Title (en)

STRIP CONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING A STRIP CONDUCTOR ARRANGEMENT

Title (de)

LEITERBAHNANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER LEITERBAHNANORDNUNG

Title (fr)

ENSEMBLE PISTES CONDUCTRICES ET PROCEDE DE FABRICATION DUDIT ENSEMBLE

Publication

EP 1419525 A2 20040519 (DE)

Application

EP 02754521 A 20020809

Priority

  • DE 0202946 W 20020809
  • DE 10140754 A 20010820

Abstract (en)

[origin: WO03019649A2] The invention relates to a conductor arrangement (100) containing a substrate (101) made from a first insulating material with a substrate surface (102), wherein at least two conductors (103) are arranged next to each other in the substrate (101). Said arrangement also comprises a buffer layer (104) made from a second insulating material arranged on the substrate (101) and a buffer layer surface (105) which is parallel to the substrate surface (102), at least one cavity (107) arranged between the conductors (103) preferably protruding deeper into the substrate (101) deeper than the conductors (103) in the substrate in relation to the buffer surface layer (105) and a covering layer made from a third insulating material (111) arranged on the buffer layer (104) and which completely closes the cavity (107) in relation to the buffer layer surface (105).

IPC 1-7

H01L 21/768

IPC 8 full level

H01L 21/768 (2006.01); H01L 23/522 (2006.01)

CPC (source: EP US)

H01L 21/7682 (2013.01 - EP US); H01L 23/5222 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

Citation (search report)

See references of WO 03019649A2

Citation (examination)

US 6242336 B1 20010605 - UEDA TETSUYA [JP], et al

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

WO 03019649 A2 20030306; WO 03019649 A3 20030807; WO 03019649 A8 20031113; DE 10140754 A1 20030327; EP 1419525 A2 20040519; TW 571422 B 20040111; US 2005079700 A1 20050414; US 7033926 B2 20060425

DOCDB simple family (application)

DE 0202946 W 20020809; DE 10140754 A 20010820; EP 02754521 A 20020809; TW 91118796 A 20020820; US 48719004 A 20040616