EP 1419529 A2 20040519 - THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATIVE MANUFACTURE METHOD
Title (en)
THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATIVE MANUFACTURE METHOD
Title (de)
3D-ELEKTRONIKBAUTEIL UND SEINE HERSTELLUNGSMETHODE
Title (fr)
DISPOSITIF ELECTRONIQUE TRIDIMENSIONNEL ET PROCEDE DE FABRICATION ASSOCIE
Publication
Application
Priority
- IT 0200304 W 20020507
- IT TO20010433 A 20010508
Abstract (en)
[origin: WO02091469A2] There is described a three-dimensional electronic device (10) having a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22); and a substantially C-shaped spacer member (26) made of electrically conducting material and extending between the first and second electronic circuit (12, 14) to connect a first contact pad (22a) of the first integrated circuit (12) electrically to a second contact pad (22b) of the second integrated circuit (14).
IPC 1-7
IPC 8 full level
H01L 25/065 (2006.01)
CPC (source: EP)
H01L 25/0657 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/0002 (2013.01)
C-Set (source: EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 02091469 A2 20021114; WO 02091469 A3 20040304; EP 1419529 A2 20040519; IT TO20010433 A0 20010508; IT TO20010433 A1 20021108
DOCDB simple family (application)
IT 0200304 W 20020507; EP 02733231 A 20020507; IT TO20010433 A 20010508