EP 1420917 A1 20040526 - METHOD AND DEVICE FOR MICROMACHINING A WORKPIECE BY MEANS OF LASER RADIATION
Title (en)
METHOD AND DEVICE FOR MICROMACHINING A WORKPIECE BY MEANS OF LASER RADIATION
Title (de)
VERFAHREN UND VORRICHTUNG ZUR MIKROBEARBEITUNG EINES WERKSTÜCKS MIT LASERSTRAHLUNG
Title (fr)
PROCEDE ET DISPOSITIF DE MICRO-USINAGE D'UNE PIECE A USINER AU MOYEN D'UN RAYONNEMENT LASER
Publication
Application
Priority
- DE 0202958 W 20020812
- DE 10140533 A 20010817
Abstract (en)
[origin: WO03018248A1] The invention relates to a method for micromachining a workpiece (3), especially for producing a borehole in the workpiece (3), by means of ultrashort-pulse laser radiation. According to the invention, a sacrificial layer (7) is applied to a surface of the workpiece (3) in a fixed manner. Ultrashort laser pulses are then generated, said pulses penetrating the sacrificial layer (7) and removing material from the workpiece (3). The sacrificial layer (7) is removed once a sufficient amount of material has been removed from the workpiece (3).
IPC 1-7
IPC 8 full level
B23K 26/06 (2006.01); B23K 26/0622 (2014.01); B23K 26/066 (2014.01); B23K 26/073 (2006.01); B23K 26/18 (2006.01); B23K 26/38 (2006.01); B23K 26/382 (2014.01); B23K 26/40 (2014.01)
CPC (source: EP)
B23K 26/0624 (2015.10); B23K 26/066 (2015.10); B23K 26/0734 (2013.01); B23K 26/18 (2013.01); B23K 26/382 (2015.10); B23K 26/389 (2015.10); B23K 26/40 (2013.01); B23K 2103/04 (2018.07); B23K 2103/05 (2018.07); B23K 2103/12 (2018.07); B23K 2103/50 (2018.07)
Citation (search report)
See references of WO 03018248A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
WO 03018248 A1 20030306; DE 10140533 A1 20030306; DE 10140533 B4 20050428; EP 1420917 A1 20040526
DOCDB simple family (application)
DE 0202958 W 20020812; DE 10140533 A 20010817; EP 02769865 A 20020812