Global Patent Index - EP 1421834 A1

EP 1421834 A1 20040526 - COMPONENT ARRANGEMENT

Title (en)

COMPONENT ARRANGEMENT

Title (de)

BAUELEMENTANORDNUNG

Title (fr)

MONTAGE D'UN COMPOSANT

Publication

EP 1421834 A1 20040526 (DE)

Application

EP 02769870 A 20020813

Priority

  • DE 0202966 W 20020813
  • DE 10142655 A 20010831

Abstract (en)

[origin: WO03028415A1] The invention relates to a component arrangement in which an electrical component (5) is sunk into a recess (4) of a printed circuit board (1), said electrical component (5) being fixed to an auxiliary printed circuit board (6) which, in turn, is connected to the printed circuit board (1). By sinking the electrical component (5) into the recess (4) of the printed circuit board (4), the amount by which the component projects (U) is advantageously reduced.

IPC 1-7

H05K 1/14

IPC 8 full level

H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01)

CPC (source: EP US)

H05K 1/141 (2013.01 - EP US); H05K 1/147 (2013.01 - EP US); H05K 1/182 (2013.01 - EP US); H05K 1/189 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H05K 3/3463 (2013.01 - EP US); H05K 3/363 (2013.01 - EP US); H05K 3/368 (2013.01 - EP US); H05K 2201/09072 (2013.01 - EP US); H05K 2201/10371 (2013.01 - EP US); H05K 2201/10477 (2013.01 - EP US)

Citation (search report)

See references of WO 03028415A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

WO 03028415 A1 20030403; CN 1550123 A 20041124; DE 10142655 A1 20030403; EP 1421834 A1 20040526; JP 2005504443 A 20050210; TW 561798 B 20031111; US 2004203260 A1 20041014

DOCDB simple family (application)

DE 0202966 W 20020813; CN 02816913 A 20020813; DE 10142655 A 20010831; EP 02769870 A 20020813; JP 2003531775 A 20020813; TW 91118889 A 20020821; US 48740104 A 20040220