EP 1423244 B9 20071003 - DEVICES FOR DETACHING SUBSTRATES AND THE ASSOCIATED METHODS
Title (en)
DEVICES FOR DETACHING SUBSTRATES AND THE ASSOCIATED METHODS
Title (de)
VORRICHTUNGEN ZUM ABTRENNEN VON SUBSTRATEN UND ZUGEHÖRIGE VERFAHREN
Title (fr)
DISPOSITIFS DE DECOLLEMENT DE SUBSTRATS ET PROCEDES ASSOCIES
Publication
Application
Priority
- FR 0202646 W 20020724
- FR 0110537 A 20010807
Abstract (en)
[origin: US7648888B2] The invention relates to a method of splitting apart a substrate of two adjoining wafers defining between them a cleavage plane, by bringing each substrate into a substrate-receiving space; and clamping first and second jaw portions onto each substrate in such a manner as to hold each substrate and urge apart the two wafers of each substrate by co-operation between the shapes of housings in first and second portions of the two jaws, respectively. The invention also relates to a splitting method that includes bringing each substrate into a substrate-reception space; clamping together separator portions onto each substrate so as to split apart the two wafers of each substrate; and clamping the split-apart substrate wafers so as to hold the wafers together. An automated system for processing multiple substrates is also provided.
IPC 8 full level
B28D 1/32 (2006.01); H01L 21/683 (2006.01); B28D 5/00 (2006.01); H01L 21/00 (2006.01); H01L 21/677 (2006.01)
CPC (source: EP KR US)
B28D 1/322 (2013.01 - EP US); B28D 5/0005 (2013.01 - EP US); H01L 21/02 (2013.01 - KR); H01L 21/67092 (2013.01 - EP US); Y10T 83/0476 (2015.04 - EP US); Y10T 225/10 (2015.04 - EP US); Y10T 225/30 (2015.04 - EP US); Y10T 225/371 (2015.04 - EP US)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
FR 2828428 A1 20030214; FR 2828428 B1 20031017; AT E357323 T1 20070415; CN 1329949 C 20070801; CN 1564730 A 20050112; DE 60219034 D1 20070503; DE 60219034 T2 20071213; EP 1423244 A1 20040602; EP 1423244 B1 20070321; EP 1423244 B9 20071003; JP 2004537866 A 20041216; JP 4509555 B2 20100721; KR 100784579 B1 20071210; KR 20040020979 A 20040309; US 2004188487 A1 20040930; US 2006138189 A1 20060629; US 7017570 B2 20060328; US 7648888 B2 20100119; WO 03013815 A1 20030220
DOCDB simple family (application)
FR 0110537 A 20010807; AT 02794609 T 20020724; CN 02819858 A 20020724; DE 60219034 T 20020724; EP 02794609 A 20020724; FR 0202646 W 20020724; JP 2003518794 A 20020724; KR 20047001956 A 20020724; US 33765506 A 20060124; US 77586504 A 20040209