EP 1423489 A1 20040602 - ADHESIVE COMPOSITION AND LOW TEMPERATURE APPLICABLE ADHESIVE SHEET
Title (en)
ADHESIVE COMPOSITION AND LOW TEMPERATURE APPLICABLE ADHESIVE SHEET
Title (de)
KLEBSTOFFZUSAMMENSETZUNG UND BEI NIEDRIGEN TEMPERATUREN AUFBRINGBARE KLEBEFOLIE
Title (fr)
COMPOSITION ADHESIVE ET FEUILLE ADHESIVE POUVANT ETRE APPLIQUEE A BASSE TEMPERATURE
Publication
Application
Priority
- JP 2001262609 A 20010831
- US 0227334 W 20020827
Abstract (en)
[origin: WO03020842A1] An adhesive composition having pressure sensitivity includes an adhesive polymer and a nonadhesive polymer. The adhesive polymer has a glass transition point by a dynamic viscoelasticity measuring method of -60°C to -5°C, and the nonadhesive polymer has a glass transition point by a differential scanning calorimeter of -5°C or less, and a fusing point of higher than 25°C by a differential scanning calorimeter, and also has compatibility with the adhesive polymer in uncrystallized state. The adhesive composition can effectively enhance pressure sensitive adhesivity at low temperatures and tack suppression effect at the same time, which makes easy an accurate positioning of the site for sticking, and which can be easily stuck by press fitting even in an environment of low temperature of lower than 0° C.
IPC 1-7
IPC 8 full level
C09J 7/02 (2006.01); C09J 7/22 (2018.01); C09J 7/38 (2018.01); C09J 133/02 (2006.01); C09J 201/00 (2006.01); C09J 201/06 (2006.01); C08L 67/00 (2006.01); C08L 77/02 (2006.01)
CPC (source: EP KR)
C09J 7/22 (2017.12 - EP); C09J 7/38 (2017.12 - EP); C09J 133/02 (2013.01 - EP); C09J 157/00 (2013.01 - KR); C09J 201/00 (2013.01 - EP); C08L 67/00 (2013.01 - EP); C08L 77/02 (2013.01 - EP); C08L 2666/20 (2013.01 - EP); C09J 2433/00 (2013.01 - EP); C09J 2467/00 (2013.01 - EP); C09J 2469/00 (2013.01 - EP)
Citation (search report)
See references of WO 03020842A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
WO 03020842 A1 20030313; CA 2458646 A1 20030313; CN 1717463 A 20060104; EP 1423489 A1 20040602; JP 2003073646 A 20030312; KR 20040044491 A 20040528
DOCDB simple family (application)
US 0227334 W 20020827; CA 2458646 A 20020827; CN 02817026 A 20020827; EP 02759473 A 20020827; JP 2001262609 A 20010831; KR 20047002845 A 20020827