Global Patent Index - EP 1427053 A1

EP 1427053 A1 20040609 - Directional coupler

Title (en)

Directional coupler

Title (de)

Richtkoppler

Title (fr)

Coupleur directif

Publication

EP 1427053 A1 20040609 (FR)

Application

EP 03300244 A 20031208

Priority

FR 0215477 A 20021206

Abstract (en)

The distributed coupler has a first and second (111,121) line conductor coupling input signals (IN, DIR) to two outputs (ISO,CPLD). There are capacitors (Cs) connected across the input and output lines.

Abstract (fr)

L'invention concerne un coupleur de type distribué comprenant une première ligne conductrice (111) véhiculant un signal principal entre deux bornes d'extrémité (IN, DIR), une deuxième ligne conductrice (121) couplée à la première et entre deux bornes (CPLD, ISO) de laquelle circule un signal prélevé, proportionnel au signal principal, et deux condensateurs (Cs) reliant respectivement les deux bornes de chacune des lignes. <IMAGE>

IPC 1-7

H01P 5/18

IPC 8 full level

H01P 5/18 (2006.01)

CPC (source: EP US)

H01P 5/186 (2013.01 - EP US)

Citation (search report)

  • [X] US 4937541 A 19900626 - PODELL ALLEN F [US], et al
  • [A] US 5629654 A 19970513 - FRICK ERIC A [US]
  • [XY] OJHA S ET AL: "Reduced size RF coupler design for specialized load requirements", CIRCUITS AND SYSTEMS, 1997. PROCEEDINGS OF THE 40TH MIDWEST SYMPOSIUM ON SACRAMENTO, CA, USA 3-6 AUG. 1997, NEW YORK, NY, USA,IEEE, US, 3 August 1997 (1997-08-03), pages 595 - 598, XP010272537, ISBN: 0-7803-3694-1
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 005, no. 125 (E - 069) 12 August 1981 (1981-08-12)
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 018, no. 022 (E - 1490) 13 January 1994 (1994-01-13)
  • [A] CHEN J-L ET AL: "A HIGH-DIRECTIVITY MICROSTRIP DIRECTIONAL COUPLER WITH FEEBACK COMPENSATION", 2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST.(IMS 2002). SEATTLE, WA, JUNE 2 - 7, 2002, IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, NEW YORK, NY: IEEE, US, vol. 1 OF 3, 2 June 2002 (2002-06-02), pages 101 - 104, XP001099454, ISBN: 0-7803-7239-5
  • [A] PATENT ABSTRACTS OF JAPAN vol. 2003, no. 02 5 February 2003 (2003-02-05)

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

EP 1427053 A1 20040609; EP 1427053 B1 20090401; DE 60326917 D1 20090514; JP 2004289797 A 20041014; US 2004113716 A1 20040617; US 7394333 B2 20080701

DOCDB simple family (application)

EP 03300244 A 20031208; DE 60326917 T 20031208; JP 2003407072 A 20031205; US 72968203 A 20031205