EP 1427869 B1 20050223 - REGENERATION METHOD FOR A PLATING SOLUTION
Title (en)
REGENERATION METHOD FOR A PLATING SOLUTION
Title (de)
REGENERATIONSVERFAHREN FÜR EINE PLATTIERUNGSLÖSUNG
Title (fr)
PROCEDE DE REGENERATION POUR SOLUTION DE PLAQUAGE
Publication
Application
Priority
- DE 10132478 A 20010703
- EP 0206654 W 20020617
Abstract (en)
[origin: WO03004725A2] The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.
IPC 1-7
IPC 8 full level
C23C 18/00 (2006.01); C23C 18/16 (2006.01)
CPC (source: EP KR US)
C23C 18/00 (2013.01 - KR); C23C 18/1617 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 03004725 A2 20030116; WO 03004725 A3 20040415; AT E289633 T1 20050315; AU 2002321069 A1 20030121; BR 0210829 A 20050503; BR 0210829 B1 20110726; CA 2450258 A1 20030116; CN 1232677 C 20051221; CN 1524132 A 20040825; DE 10132478 C1 20030430; DE 60203050 D1 20050331; DE 60203050 T2 20060223; EP 1427869 A2 20040616; EP 1427869 B1 20050223; ES 2236552 T3 20050716; HK 1062926 A1 20041203; JP 2004534151 A 20041111; JP 4157838 B2 20081001; KR 100827259 B1 20080507; KR 20040030725 A 20040409; MX PA03011772 A 20040402; MY 130423 A 20070629; TW I279456 B 20070421; US 2004245108 A1 20041209
DOCDB simple family (application)
EP 0206654 W 20020617; AT 02754692 T 20020617; AU 2002321069 A 20020617; BR 0210829 A 20020617; CA 2450258 A 20020617; CN 02813582 A 20020617; DE 10132478 A 20010703; DE 60203050 T 20020617; EP 02754692 A 20020617; ES 02754692 T 20020617; HK 04105703 A 20040803; JP 2003510478 A 20020617; KR 20037017284 A 20031231; MX PA03011772 A 20020617; MY PI20022395 A 20020626; TW 91113655 A 20020621; US 49421704 A 20040503