Global Patent Index - EP 1430366 A1

EP 1430366 A1 20040623 - METHOD FOR PRODUCING A FOIL MATERIAL, PROVIDED WITH AN EMBOSSED HOLOGRAM, AS WELL AS A FOIL MATERIAL

Title (en)

METHOD FOR PRODUCING A FOIL MATERIAL, PROVIDED WITH AN EMBOSSED HOLOGRAM, AS WELL AS A FOIL MATERIAL

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES MIT EINER HOLOGRAMMPRÄGUNG VERSEHENEN FOLIENMATERIALS SOWIE FOLIENMATERIAL

Title (fr)

PROCEDE DE PRODUCTION D'UN MATERIAU EN FEUILLES, POURVU D'UN HOLOGRAMME ESTAMPE, ET MATERIAU EN FEUILLES CORRESPONDANT

Publication

EP 1430366 A1 20040623 (DE)

Application

EP 02767392 A 20020814

Priority

  • DE 10146635 A 20010921
  • EP 0209139 W 20020814

Abstract (en)

[origin: WO03027775A1] The invention relates to a method for producing a foil material, provided with an embossed hologram. Said method comprises the following steps: optionally metallizing said material, applying a lubricant and then directly embossing said material, the embossed surface remaining the material top layer. Said invention also relates to a foil material having the following structure: a metal layer, provided with an embossed hologram, and a lubricant layer, which is at least partially applied to said metal layer, whereby said material top layer is exclusively formed by the metal layer and/or the lubricant layer.

IPC 1-7

G03H 1/20; D21H 19/02; D21H 27/10; B65D 65/38

IPC 8 full level

D21H 19/66 (2006.01); G03H 1/20 (2006.01); D21H 11/04 (2006.01)

CPC (source: EP US)

D21H 19/66 (2013.01 - EP US); G03H 1/20 (2013.01 - EP US); B65D 2203/00 (2013.01 - EP US); D21H 11/04 (2013.01 - EP US); Y10T 29/301 (2015.01 - EP US)

Citation (search report)

See references of WO 03027775A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

DOCDB simple family (publication)

WO 03027775 A1 20030403; CA 2460815 A1 20030403; DE 10146635 A1 20030424; DE 10146635 B4 20050623; EA 005833 B1 20050630; EA 200400450 A1 20040826; EP 1430366 A1 20040623; US 2004231118 A1 20041125

DOCDB simple family (application)

EP 0209139 W 20020814; CA 2460815 A 20020814; DE 10146635 A 20010921; EA 200400450 A 20020814; EP 02767392 A 20020814; US 48948004 A 20040405