EP 1430524 A2 20040623 - METHOD FOR CONTACTING ELECTRICAL CONTACT SURFACES OF A SUBSTRATE AND DEVICE CONSISTING OF A SUBSTRATE HAVING ELECTRICAL CONTACT SURFACES
Title (en)
METHOD FOR CONTACTING ELECTRICAL CONTACT SURFACES OF A SUBSTRATE AND DEVICE CONSISTING OF A SUBSTRATE HAVING ELECTRICAL CONTACT SURFACES
Title (de)
VERFAHREN ZUM KONTAKTIEREN ELEKTRISCHER KONTAKTFLÄCHEN EINES SUBSTRATS UND VORRICHTUNG AUS EINEM SUBSTRAT MIT ELEKTRISCHEN KONTAKTFLÄCHEN
Title (fr)
PROCEDE D'ETABLISSEMENT DE CONTACT POUR DES SURFACES DE CONTACT ELECTRIQUES SITUEES SUR UN SUBSTRAT ET DISPOSITIF CONSTITUE D'UN SUBSTRAT POURVU DE SURFACES DE CONTACT ELECTRIQUES
Publication
Application
Priority
- DE 0203615 W 20020925
- DE 10147935 A 20010928
Abstract (en)
[origin: WO03030247A2] The invention relates to a method for contacting electrical contact surfaces (21, 112) on a surface (20) of a substrate (1). According to said method, a film (3) based on polyimide or epoxy is laminated onto the surface, under a vacuum, in such a way that the film closely covers the surface comprising the contact surfaces and adheres to the same. Each contact surface to be contacted on the surface is uncovered by opening respective windows (31) in the film, and a contact is established in a plane manner between each uncovered contact surface and a layer (4) of metal. The inventive method is used to establish a large-surface contact for power semiconductor chips, enabling a high current density.
IPC 1-7
IPC 8 full level
H01L 23/051 (2006.01); H01L 23/373 (2006.01); H01L 23/482 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP KR US)
H01L 23/02 (2013.01 - KR); H01L 23/051 (2013.01 - EP US); H01L 23/3735 (2013.01 - EP US); H01L 23/482 (2013.01 - EP US); H01L 24/24 (2013.01 - EP US); H01L 24/82 (2013.01 - EP US); H01L 25/072 (2013.01 - EP US); H05K 1/16 (2013.01 - KR); H05K 3/4605 (2013.01 - EP US); H05K 3/4632 (2013.01 - EP US); H01L 2224/2402 (2013.01 - EP US); H01L 2224/24051 (2013.01 - EP US); H01L 2224/24225 (2013.01 - EP US); H01L 2224/24226 (2013.01 - EP US); H01L 2224/45124 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01061 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/01327 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/19043 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 3/108 (2013.01 - EP US); H05K 3/32 (2013.01 - EP US); H05K 2201/0129 (2013.01 - EP US); H05K 2201/0154 (2013.01 - EP US); H05K 2203/068 (2013.01 - EP US); H05K 2203/085 (2013.01 - EP US); H05K 2203/1469 (2013.01 - EP US)
Citation (search report)
See references of WO 03030247A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
WO 03030247 A2 20030410; WO 03030247 A3 20031009; AU 2002340750 A1 20030414; CN 1575511 A 20050202; EP 1430524 A2 20040623; JP 2005515616 A 20050526; KR 100896906 B1 20090512; KR 20040037173 A 20040504; US 2005032347 A1 20050210; US 7402457 B2 20080722
DOCDB simple family (application)
DE 0203615 W 20020925; AU 2002340750 A 20020925; CN 02819063 A 20020925; EP 02774408 A 20020925; JP 2003533338 A 20020925; KR 20047004531 A 20020925; US 49113704 A 20040329