EP 1438748 A2 20040721 - MICRO- OR NANO-ELECTRONIC COMPONENT COMPRISING A POWER SOURCE AND MEANS FOR PROTECTING THE POWER SOURCE
Title (en)
MICRO- OR NANO-ELECTRONIC COMPONENT COMPRISING A POWER SOURCE AND MEANS FOR PROTECTING THE POWER SOURCE
Title (de)
MIKRO ODER NANO-ELEKTRONISCHE KOMPONENTE MIT EINER ENERGIEQUELLE UND MITTEL ZUM SCHÜTZ DER ENERGIEQUELLE
Title (fr)
COMPOSANT MICRO OU NANO-ELECTRONIQUE COMPORTANT UNE SOURCE D'ENERGIE ET DES MOYENS DE PROTECTION DE LA SOURCE D'ENERGIE
Publication
Application
Priority
- FR 0203589 W 20021021
- FR 0113569 A 20011022
Abstract (en)
[origin: FR2831327A1] A microelectronic or nanoelectronic component including an energy source formed on a substrate (2) incorporates a sealed cavity (9) in which are arranged the parts of the components that are to be protected, these being at least the energy sources (4-7) made up of a microbattery or a microsupercapacitor. A microelectronic or nanoelectronic component including an energy source formed on a substrate (2) incorporates a sealed cavity (9) in which are arranged the parts of the components that are to be protected, these being at least the energy sources (4-7) made up of a microbattery or a microsupercapacitor. The cavity may be under vacuum or filled with an inert gas. A pressure sensor may be arranged inside the cavity and detects a variation in the pressure inside the cavity in order to render the components unusable when the pressure variation passes a predetermined threshold. The cavity may be closed by a cover (10) or filled with a filler material made up of silicon resin, thermohardening resin, polymer, epoxy, fusible glass or by a metal such as indium, tin, lead or their alloys.
IPC 1-7
IPC 8 full level
G06K 19/073 (2006.01); H01G 9/00 (2006.01); H01L 21/48 (2006.01); H01L 23/20 (2006.01); H01L 23/26 (2006.01); H01L 23/58 (2006.01)
CPC (source: EP KR US)
G06K 19/073 (2013.01 - EP US); G06K 19/07372 (2013.01 - EP US); H01L 21/4803 (2013.01 - EP US); H01L 23/20 (2013.01 - EP KR US); H01L 23/573 (2013.01 - EP US); H01L 23/58 (2013.01 - EP KR US); H01L 25/00 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP US); H01L 2924/15153 (2013.01 - EP US); H01L 2924/15165 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/16195 (2013.01 - EP US)
Citation (search report)
See references of WO 03036719A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
FR 2831327 A1 20030425; FR 2831327 B1 20040625; AU 2002360134 A1 20030506; CN 1300847 C 20070214; CN 1575523 A 20050202; EP 1438748 A2 20040721; JP 2005506714 A 20050303; KR 20040071130 A 20040811; US 2005001214 A1 20050106; WO 03036719 A2 20030501; WO 03036719 A3 20040304
DOCDB simple family (application)
FR 0113569 A 20011022; AU 2002360134 A 20021021; CN 02820965 A 20021021; EP 02795333 A 20021021; FR 0203589 W 20021021; JP 2003539104 A 20021021; KR 20047006007 A 20021021; US 49204804 A 20040407