EP 1439244 A2 20040721 - Method for plating and plating solution thereof
Title (en)
Method for plating and plating solution thereof
Title (de)
Verfahren zum Plattieren und Plattierungslösung
Title (fr)
Procédé de placage et solution de placage
Publication
Application
Priority
- EP 04447010 A 20040114
- EP 03447008 A 20030114
Abstract (en)
A solution is described, in particular for electroless deposition of a metal on a polyimide substrate. The solution from which the metal is deposited, comprises a source of metal ions; a reducing agent; an additive to adjust the pH of said bath to a predetermined value; and an aromatic sulfonic acid. The solution is used in a method for electroless deposition of a metal onto a substrate wherein the substrate preferably comprises polyimide exposed at a surface thereof. The method of the present invention provides a metal layer which shows good adhesion towards the polyimide substrate and which is very smooth and does not need any additional smoothening treatment. <IMAGE>
IPC 1-7
IPC 8 full level
C23C 18/31 (2006.01); C23C 18/40 (2006.01); C23C 18/48 (2006.01)
CPC (source: EP)
C23C 18/31 (2013.01); C23C 18/40 (2013.01); C23C 18/48 (2013.01)
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
DOCDB simple family (application)
EP 04447010 A 20040114