EP 1444728 A1 20040811 - METHOD FOR PRODUCING A PROTECTION FOR CHIP EDGES AND SYSTEM FOR THE PROTECTION OF CHIP EDGES
Title (en)
METHOD FOR PRODUCING A PROTECTION FOR CHIP EDGES AND SYSTEM FOR THE PROTECTION OF CHIP EDGES
Title (de)
VERFAHREN ZUM HERSTELLEN EINES SCHUTZES FÜR CHIPKANTEN UND ANORDNUNG ZUM SCHUTZ VON CHIPKANTEN
Title (fr)
PROCEDE D'OBTENTION D'UNE PROTECTION DES BORDS D'UNE PUCE, ET DISPOSITIF DE PROTECTION Y RELATIF
Publication
Application
Priority
- DE 0300012 W 20030107
- DE 10201204 A 20020114
Abstract (en)
[origin: WO03058704A1] The invention relates to a method for producing a protection for the chip edges of electronic components that are not provided with a housing, according to which semiconductor chips provided with a laterally open bonding channel are mounted on a substrate with a tape interposed between. The invention further relates to a system for protecting chip edges. The aim of the invention is to provide a method which is easy to carry out and to provide a system for the secure protection of chip edges/corners. This aim is achieved by using for the assembly of the semiconductor chip on the substrate a tape whose cross- section is smaller than the cross-section of the semiconductor so that between the semiconductor and the substrate, along its outer edge, a peripheral recessed section is formed as a capillary. After establishment of the electrical connections between the semiconductor and the substrate, in a first step, a flowable encapsulation material is introduced into the bonding channel by wire-bonding until the encapsulation material evenly encloses the borders of the semiconductor chip. In a second step, the bonding channel is completely filled with the encapsulation material.
IPC 1-7
IPC 8 full level
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/58 (2006.01); H01L 23/13 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H05K 3/30 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 23/3185 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2924/15151 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US)
Citation (search report)
See references of WO 03058704A1
Designated contracting state (EPC)
DE FR GB IE IT
DOCDB simple family (publication)
WO 03058704 A1 20030717; DE 10201204 A1 20030731; EP 1444728 A1 20040811; TW 200304190 A 20030916; TW 591727 B 20040611; US 2005064630 A1 20050324; US 7229857 B2 20070612
DOCDB simple family (application)
DE 0300012 W 20030107; DE 10201204 A 20020114; EP 03702311 A 20030107; TW 92100708 A 20030114; US 89082704 A 20040714