Global Patent Index - EP 1445004 A4

EP 1445004 A4 20060719 - METHOD FOR ADHESION OF SURFACE SKIN OF BALL

Title (en)

METHOD FOR ADHESION OF SURFACE SKIN OF BALL

Title (de)

VERFAHREN ZUM ANKLEBEN DER AUSSENHÜLLE EINES BALLS

Title (fr)

PROCEDE PERMETTANT DE COLLER UNE PEAU DE SURFACE D'UN BALLON

Publication

EP 1445004 A4 20060719 (EN)

Application

EP 02713246 A 20020328

Priority

  • JP 0203132 W 20020328
  • JP 2001329827 A 20011026
  • JP 2001007021 U 20011029

Abstract (en)

[origin: EP1445004A1] A method for adhering a surface skin of a ball, which uses a means that is free of solvent and involves no solvent, and which is friendly to the environment, creates no odor, poses no danger of fire attributable to catalysts, eliminates the solvent drying time and space that would otherwise be required, and requires no particular skill. In a ball, an adhesive layer 2 is provided on the outer surface of a carcass 1, and a surface skin 3 is placed over the adhesive layer 2; or the adhesive layer 2 is provided on the inner surface of the surface skin 3, and the surface skin 3 is placed over the carcass 1; and adhesion is performed using a means free of solvent. Here, the carcass 1 includes the adhesive layer 2 provided over a tube 1a or includes a reinforcing layer 4 provided over the tube 1a, and the adhesive layer 2 provided over the reinforcing layer 4. <IMAGE>

IPC 1-7

A63B 45/00

IPC 8 full level

A63B 41/10 (2006.01); A63B 45/00 (2006.01); A63B 45/02 (2006.01); A63B 41/00 (2006.01)

CPC (source: EP US)

A63B 41/00 (2013.01 - EP US); A63B 41/10 (2013.01 - EP US); A63B 45/00 (2013.01 - EP US); A63B 45/02 (2013.01 - EP US); Y10T 156/103 (2015.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1445004 A1 20040811; EP 1445004 A4 20060719; CN 1571689 A 20050126; US 2005000630 A1 20050106; WO 03035187 A1 20030501

DOCDB simple family (application)

EP 02713246 A 20020328; CN 02820532 A 20020328; JP 0203132 W 20020328; US 49286504 A 20040415