EP 1445994 A4 20080618 - WIRING BOARD SHEET AND ITS MANUFACTURING METHOD, MULTILAYER BOARD, AND ITS MANUFACTURNG METHOD
Title (en)
WIRING BOARD SHEET AND ITS MANUFACTURING METHOD, MULTILAYER BOARD, AND ITS MANUFACTURNG METHOD
Title (de)
LEITERPLATTENMATERIAL UND VERFAHREN ZU SEINER HERSTELLUNG, MEHRSCHICHTIGE LEITERPLATTE UND VERFAHREN ZU IHRER HERSTELLUNG
Title (fr)
FEUILLE DE PANNEAU DE CABLAGE ET SON PROCEDE DE FABRICATION, PANNEAU MULTICOUCHE ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- JP 0211194 W 20021028
- JP 2001329935 A 20011026
- JP 2002247839 A 20020827
Abstract (en)
[origin: EP1445994A1] A Wiring board sheet which enables the miniaturization of a wiring board by mounting electric components (10) in an insulation layer (4) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet. A multilayer board which is manufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board. <IMAGE>
IPC 1-7
IPC 8 full level
H05K 1/18 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP KR US)
H05K 1/187 (2013.01 - EP US); H05K 3/4069 (2013.01 - EP US); H05K 3/46 (2013.01 - KR); H05K 3/20 (2013.01 - EP US); H05K 3/4614 (2013.01 - EP US); H05K 3/4652 (2013.01 - EP US); H05K 3/4658 (2013.01 - EP US); H05K 2201/0394 (2013.01 - EP US); H05K 2201/10378 (2013.01 - EP US); H05K 2203/1453 (2013.01 - EP US); H05K 2203/1461 (2013.01 - EP US); Y10T 29/49117 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49144 (2015.01 - EP US); Y10T 29/49165 (2015.01 - EP US)
Citation (search report)
- [XY] US 6038133 A 20000314 - NAKATANI SEIICHI [JP], et al
- [DAY] JP H11126978 A 19990511 - KYOCERA CORP
- [PX] EP 1189272 A1 20020320 - MATSUSHITA ELECTRIC IND CO LTD [JP]
- [PX] US 2002117743 A1 20020829 - NAKATANI SEIICHI [JP], et al & WO 0169670 A1 20010920 - MATSUSHITA ELECTRIC IND CO LTD [JP], et al
- See references of WO 03037050A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
EP 1445994 A1 20040811; EP 1445994 A4 20080618; EP 1445994 B1 20120307; AT E548891 T1 20120315; CN 100442955 C 20081210; CN 1575627 A 20050202; JP 2003204167 A 20030718; JP 4392157 B2 20091224; KR 101045554 B1 20110704; KR 20040062587 A 20040707; US 2005118750 A1 20050602; US 7080446 B2 20060725; WO 03037050 A1 20030501
DOCDB simple family (application)
EP 02777983 A 20021028; AT 02777983 T 20021028; CN 02821061 A 20021028; JP 0211194 W 20021028; JP 2002247839 A 20020827; KR 20047006162 A 20021028; US 49376004 A 20040426