EP 1449246 A2 20040825 - INSULATION TRENCH FOR AN INTEGRATED CIRCUIT AND METHOD FOR PRODUCTION THEREOF
Title (en)
INSULATION TRENCH FOR AN INTEGRATED CIRCUIT AND METHOD FOR PRODUCTION THEREOF
Title (de)
ISOLATIONSGRABEN FUR EINE INTEGRIERTE SCHALTUNG UND VERFAHREN ZU DESSEN HERSTELLUNG
Title (fr)
TRANCHEE D'ISOLATION DESTINEE A UN CIRCUIT INTEGRE ET PROCEDE DE FABRICATION DE CETTE TRANCHEE
Publication
Application
Priority
- DE 10157785 A 20011127
- EP 0212838 W 20021115
Abstract (en)
[origin: WO03046977A2] The invention relates to an insulation trench (1) for an integrated circuit, formed in a substrate (2) and filled with an insulation medium (7) with a low relative dielectric constant. On the upper face thereof, the insulation trench is sealed with a cover (12), such that the insulating medium (7) is completely encapsulated. The invention further relates to a bottle-shaped insulation trench and a method for production of an insulation trench.
IPC 1-7
IPC 8 full level
H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 21/8234 (2006.01)
CPC (source: EP)
H01L 21/76232 (2013.01); H01L 21/764 (2013.01); H01L 21/823481 (2013.01)
Citation (search report)
See references of WO 03046977A2
Citation (examination)
- US 6268637 B1 20010731 - GARDNER MARK I [US], et al
- GB 2314682 A 19980107 - HYUNDAI ELECTRONICS IND [KR]
- US 6144086 A 20001107 - BROWN JEFFREY SCOTT [US], et al
- JP H05299498 A 19931112 - SHIRATO TAKEHIDE
- US 6251734 B1 20010626 - GRIVNA GORDON M [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
WO 03046977 A2 20030605; WO 03046977 A3 20040212; AU 2002364274 A1 20030610; AU 2002364274 A8 20030610; DE 10157785 A1 20030612; EP 1449246 A2 20040825
DOCDB simple family (application)
EP 0212838 W 20021115; AU 2002364274 A 20021115; DE 10157785 A 20011127; EP 02799043 A 20021115