EP 1452562 A1 20040901 - LOW-TEMPERATURE-DECOMPOSABLE ENGINEERING PLASTIC RESIN COMPOSITION AND PROCESS FOR PRODUCING MOLDED OBJECT OF THE COMPOSITION
Title (en)
LOW-TEMPERATURE-DECOMPOSABLE ENGINEERING PLASTIC RESIN COMPOSITION AND PROCESS FOR PRODUCING MOLDED OBJECT OF THE COMPOSITION
Title (de)
BEI NIEDRIGER TEMPERATUR ZERSETZBARE TECHNISCHE KUNSTSTOFFHARZZUSAMMENSETZUNG UND VERFAHREN ZUR HERSTELLUNG EINES FORMKÖRPERS AUS DER ZUSAMMENSETZUNG
Title (fr)
COMPOSITION A BASE DE RESINE PLASTIQUE D'INGENIERIE DECOMPOSABLE A BASSE TEMPERATURE ET PROCEDE DE PRODUCTION D'UN OBJET MOULE A PARTIR DE CETTE COMPOSITION
Publication
Application
Priority
- JP 0212147 W 20021121
- US 98916001 A 20011121
Abstract (en)
The present invention is a low-temperature-decomposable engineering plastic resin composition prepared by formulating a low-temperature-decomposable engineering plastic with a fluorine-containing resin, wherein said low-temperature-decomposable engineering plastic has a melting point of not higher than 200 DEG C and a decomposition temperature of not higher than 300 DEG C, and wherein said fluorine-containing resin is a resin comprising a fluorine-containing polymer, said fluorine-containing polymer having a fluorine atom and at least one atom species selected from the group consisting of hydrogen atom, chlorine atom, bromine atom and iodine atom, said fluorine atom and said at least one atom species being bound to a non-terminal carbon atom constituting a main chain, and said fluorine-containing polymer having substantially no polar functional groups reactive to the low-temperature-decomposable engineering plastic.
IPC 1-7
IPC 8 full level
C08G 65/00 (2006.01); C08L 59/02 (2006.01); C08L 71/00 (2006.01); C08L 101/00 (2006.01)
CPC (source: EP US)
C08G 65/007 (2013.01 - EP US); C08L 59/02 (2013.01 - EP US); C08L 71/00 (2013.01 - EP US); C08L 77/00 (2013.01 - US); C08L 77/06 (2013.01 - EP); C08L 101/00 (2013.01 - EP US); C08G 2650/48 (2013.01 - EP US)
Citation (search report)
See references of WO 03044088A1
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
DOCDB simple family (publication)
US 2003109646 A1 20030612; CN 1541251 A 20041027; CN 1547603 A 20041117; EP 1452562 A1 20040901; EP 1454963 A1 20040908; EP 1454963 A8 20041222; JP WO2003044088 A1 20050310; JP WO2003044093 A1 20050310; TW 200300429 A 20030601; TW 200300430 A 20030601; US 2004242771 A1 20041202; WO 03044088 A1 20030530; WO 03044093 A1 20030530
DOCDB simple family (application)
US 98916001 A 20011121; CN 02815788 A 20021121; CN 02815789 A 20021121; EP 02783579 A 20021121; EP 02785943 A 20021121; JP 0212147 W 20021121; JP 0212148 W 20021121; JP 2003545722 A 20021121; JP 2003545726 A 20021121; TW 91133908 A 20021121; TW 91133909 A 20021121; US 38082503 A 20030820