EP 1456880 A2 20040915 - METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
Title (en)
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN BAUTEILS
Title (fr)
PROCEDE DE PRODUCTION D'UN COMPOSANT ELECTRONIQUE
Publication
Application
Priority
- DE 0204529 W 20021211
- DE 10163084 A 20011220
Abstract (en)
[origin: WO03054957A2] The invention relates to an electronic component (1) and a method for producing the same. Said electronic component (1) comprises a semiconductor chip (2), a rewiring plate (3) and a plastic housing (4) which is divided into two plastic parts (23) arranged one on top of the other. A first layer (5) forming one of the plastic housing parts (23) has a relatively uneven surface which is smoothed by a second layer (6) forming the other plastic housing part (23), in such a way that the electronic component (1) is provided with a plastic housing (4) having smooth outer sides.
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 23/3114 (2013.01 - EP US); H01L 23/3121 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/45099 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/4824 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73215 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2224/97 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01032 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Citation (search report)
See references of WO 03054957A2
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 03054957 A2 20030703; WO 03054957 A3 20030925; DE 10163084 A1 20030717; EP 1456880 A2 20040915; US 2004262780 A1 20041230; US 6998296 B2 20060214
DOCDB simple family (application)
DE 0204529 W 20021211; DE 10163084 A 20011220; EP 02791626 A 20021211; US 86885504 A 20040617