Global Patent Index - EP 1458931 A1

EP 1458931 A1 20040922 - SIZING METHOD FOR BOARD

Title (en)

SIZING METHOD FOR BOARD

Title (de)

LEIMVERFAHREN FÜR PAPPE

Title (fr)

PROCEDE D'ENCOLLAGE D'UNE PLANCHE

Publication

EP 1458931 A1 20040922 (EN)

Application

EP 02785476 A 20021213

Priority

  • FI 0201021 W 20021213
  • FI 20012511 A 20011219

Abstract (en)

[origin: WO03052204A1] A method for managing the water sorption of board by means of layered sizing, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation of calendering with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption substantially takes place only into a topliner.

IPC 1-7

D21H 21/16; D21F 11/04

IPC 8 full level

D21F 11/04 (2006.01); D21H 23/70 (2006.01); D21H 25/00 (2006.01); D21H 27/30 (2006.01); D21H 21/16 (2006.01); D21H 27/10 (2006.01)

CPC (source: EP US)

D21F 11/04 (2013.01 - EP US); D21H 23/70 (2013.01 - EP US); D21H 25/005 (2013.01 - EP US); D21H 27/30 (2013.01 - EP US); D21H 21/16 (2013.01 - EP US); D21H 27/10 (2013.01 - EP US)

Citation (search report)

See references of WO 03052204A1

Designated contracting state (EPC)

AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR

DOCDB simple family (publication)

WO 03052204 A1 20030626; AU 2002350781 A1 20030630; EP 1458931 A1 20040922; FI 117761 B 20070215; FI 20012511 A0 20011219; FI 20012511 A 20030620; US 2005072541 A1 20050407

DOCDB simple family (application)

FI 0201021 W 20021213; AU 2002350781 A 20021213; EP 02785476 A 20021213; FI 20012511 A 20011219; US 49734504 A 20041130