EP 1461370 A1 20040929 - ORGANIC COMPOSITIONS
Title (en)
ORGANIC COMPOSITIONS
Title (de)
ORGANISCHE ZUSAMMENSETZUNGEN
Title (fr)
COMPOSITIONS ORGANIQUES
Publication
Application
Priority
US 0150182 W 20011231
Abstract (en)
[origin: WO03057749A1] The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherein Y is selected from cage compound and silicon atom; R1, R 2, R3, R4, R5, and R6 are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether has an ethynyl group; R7 is aryl or substituted aryl; and at least one of the R1, R2, R3, R4, R5, and R6 comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to a substrate. The present composition is particularly useful as a dielectric material in microelectronic applications.
IPC 1-7
IPC 8 full level
C08K 5/10 (2006.01); C08F 38/00 (2006.01); C08G 8/10 (2006.01); C08G 61/02 (2006.01); C08G 65/40 (2006.01); C08G 77/00 (2006.01); C08G 77/60 (2006.01); C08K 5/34 (2006.01); C08L 49/00 (2006.01); C08L 61/10 (2006.01); C08L 63/00 (2006.01); C08L 65/00 (2006.01); C08L 71/10 (2006.01); C08L 83/16 (2006.01); C08L 101/02 (2006.01); H01L 21/312 (2006.01); H05K 1/03 (2006.01)
CPC (source: EP KR)
C08G 8/10 (2013.01 - KR); C08G 14/04 (2013.01 - KR); C08G 61/02 (2013.01 - EP); C08L 65/00 (2013.01 - EP); C08L 83/16 (2013.01 - EP)
Citation (search report)
See references of WO 03057749A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 03057749 A1 20030717; CA 2443846 A1 20030717; CN 1494559 A 20040505; EP 1461370 A1 20040929; JP 2005514479 A 20050519; KR 20040068857 A 20040802
DOCDB simple family (application)
US 0150182 W 20011231; CA 2443846 A 20011231; CN 01823120 A 20011231; EP 01994423 A 20011231; JP 2003558060 A 20011231; KR 20037012481 A 20030925