Global Patent Index - EP 1461470 A4

EP 1461470 A4 20050914 - THERMO-MECHANICAL TREATED LEAD ALLOYS

Title (en)

THERMO-MECHANICAL TREATED LEAD ALLOYS

Title (de)

THERMOMECHANISCH BEHANDELTE BLEILEGIERUNGEN

Title (fr)

ALLIAGES DE PLOMB TRAITES DE MANIERE THERMO-MECANIQUE

Publication

EP 1461470 A4 20050914 (EN)

Application

EP 01989121 A 20011126

Priority

US 0144061 W 20011126

Abstract (en)

[origin: CA2468022A1] Recrystallized lead and lead alloy positive current collectors and connector s such as straps and lugs for use e.g. in lead acid batteries and electrowinni ng anodes, having an increased percentage of special grain boundaries in at lea st part of the microstructure, which have been provided by a process comprising of (i) cold or hot rolling or cold or hot extrusion or (ii) steps of deformi ng the lead or lead alloy, and subsequently annealing the lead or lead alloy. Either a single cycle of working and annealing can be provided, or a plurali ty of such cycles can be provided. The amount of deformation, the recrystallization time and temperature, and the number of repetitions of suc h steps are selected to ensure that a substantial increase in the population o f special grain boundaries is provided in the microstructure, to improve resistance to creep, intergranular corrosion and intergranular cracking of t he current collectors and connectors during battery service, and result in extended battery life and the opportunity to reduce the size and weight of t he battery.

IPC 1-7

C22F 1/12; C22C 11/00; C22C 11/06; H01M 4/68

IPC 8 full level

C22C 11/06 (2006.01); C22F 1/00 (2006.01); C22F 1/12 (2006.01); H01M 4/68 (2006.01)

CPC (source: EP KR)

C22C 11/00 (2013.01 - KR); C22F 1/12 (2013.01 - KR); Y02E 60/10 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

AU 2002243237 A1 20030610; BR 0117183 A 20041103; CA 2468022 A1 20030605; EP 1461470 A2 20040929; EP 1461470 A4 20050914; JP 2005510628 A 20050421; KR 20040066847 A 20040727; MX PA04004943 A 20050408

DOCDB simple family (application)

AU 2002243237 A 20011126; BR 0117183 A 20011126; CA 2468022 A 20011126; EP 01989121 A 20011126; JP 2003547671 A 20011126; KR 20047007993 A 20011126; MX PA04004943 A 20011126