EP 1463103 A1 20040929 - Underfill method
Title (en)
Underfill method
Title (de)
Verfahren zur Unterfüllung
Title (fr)
Méthode de sous-remplissage
Publication
Application
Priority
US 39760503 A 20030326
Abstract (en)
A process for selectively depositing a filled underfill material (14) onto a die surface without covering solder bumps (12) present on the die (10). The process entails microjetting a polymer matrix material, a filler material, and optionally a fluxing material (22) onto the die surface. Together, the polymer matrix and filler materials define the filled underfill material (14) in which the filler material is dispersed to reduce the coefficient of thermal expansion of the underfill material (14). The resulting underfill material (14) surrounds but does not cover the solder bumps (12). The die (10) is then placed on a substrate (16) on which a second underfill material (26) is present, forming a composite underfill layer (24) that completely fills the space between the die (10) and substrate (16) and forms a fillet (28) on a peripheral wall (30) of the die (10). <IMAGE> <IMAGE>
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01)
CPC (source: EP US)
H01L 21/563 (2013.01 - EP US); H01L 24/27 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/29036 (2013.01 - EP US); H01L 2224/32225 (2013.01 - EP US); H01L 2224/73104 (2013.01 - EP US); H01L 2224/73203 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/83191 (2013.01 - EP US); H01L 2224/83192 (2013.01 - EP US); H01L 2224/83193 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01039 (2013.01 - EP US); H01L 2924/01075 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49144 (2015.01 - EP US); Y10T 29/49146 (2015.01 - EP US); Y10T 29/49176 (2015.01 - EP US); Y10T 29/49179 (2015.01 - EP US)
Citation (search report)
- [XY] WO 02058108 A2 20020725 - HENKEL LOCTITE CORP [US], et al
- [A] US 6121689 A 20000919 - CAPOTE MIGUEL A [US], et al
- [A] WO 9904430 A1 19990128 - AGUILA TECHNOLOGIES INC [US], et al
- [DA] US 5681757 A 19971028 - HAYES DONALD J [US]
- [Y] D.J. HAYES ET AL.: "Development and application by ink-jet printing of advanced packaging materials", PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 14 March 1999 (1999-03-14) - 17 March 1999 (1999-03-17), pages 88 - 93, XP002285386
- [A] "Highly pure and spherical silica", ADMATECHS WEBSITE, 27 February 2003 (2003-02-27), XP002285387, Retrieved from the Internet <URL:http://web.archive.org/web/20030227131125/http://www.admatechs.co.jp/sie.html> [retrieved on 20040622]
Citation (examination)
YALA N ET AL: "Characterization of flip chip assembly utilizing wafer applied underfill", 2002 PROCEEDINGS 52ND. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 2002. SAN DIEGO, CA, MAY 28 - 31, 2002; [PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE], NEW YORK, NY : IEEE, US, vol. CONF. 52, 28 May 2002 (2002-05-28), pages 1380 - 1384, XP010747816, ISBN: 978-0-7803-7430-0, DOI: 10.1109/ECTC.2002.1008286
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1463103 A1 20040929; EP 1463103 A8 20041208; US 2005014313 A1 20050120; US 2006200985 A1 20060914; US 7331106 B2 20080219
DOCDB simple family (application)
EP 04075759 A 20040309; US 39760503 A 20030326; US 43521106 A 20060515