EP 1469319 A1 20041020 - Flip-chip mounting method and mounting apparatus of electronic part
Title (en)
Flip-chip mounting method and mounting apparatus of electronic part
Title (de)
Verfahren und Vorrichtung zur "Flip-Chip" Montage eines elektronischen Bauteils
Title (fr)
Procédé et appareillage pour le montage "flip-chip" de composants électroniques
Publication
Application
Priority
- EP 99106876 A 19990407
- JP 9733598 A 19980409
Abstract (en)
The present invention relates to a mounting apparatus (40) for mounting an electronic part (3) utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system, comprising an ultrasonic vibration generating device (8), a horn (7) attached to the ultrasonic vibration generating device (8), a collet tool (6) for holding an electronic part (3) attached to the horn (7), a control unit (9) being connected to the ultrasonic vibration generating device (8), and a substrate conductor heating unit (4) connected to said control unit (9). To inspect the state of the formed joint a measuring device for monitoring a voltage, an electric current, or both to be applied to the ultrasonic vibration generating device (8) is connected with the control unit (9). Thus, it is possible to measure a voltage and/or an electric current (i) applied to the ultrasonic vibration generating device (9), to respectively compare the measured voltage and/or electric current (i) with reference wave forms to determine whether the voltage and/or electric current are applied normally to the ultrasonic vibrating generating device (9) and to judge the formed connection defective or non-defective in accordance with the results of the comparison of the measured voltage and/or electric current with reference wave forms. <IMAGE>
IPC 1-7
G01R 31/04; H01L 21/60; H01L 21/607; H01L 21/603; H01L 21/66
IPC 8 full level
G01B 21/02 (2006.01); B23K 20/02 (2006.01); B23K 20/10 (2006.01); H01L 21/60 (2006.01); H01L 21/603 (2006.01); H01L 21/607 (2006.01)
CPC (source: EP US)
B23K 20/023 (2013.01 - EP US); B23K 20/025 (2013.01 - EP US); B23K 20/10 (2013.01 - EP US); B23K 20/106 (2013.01 - EP US); B29C 65/08 (2013.01 - EP US); H01L 24/75 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); B23K 2101/40 (2018.07 - EP US); B29C 66/8322 (2013.01 - EP US); H01L 2224/13144 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/75 (2013.01 - EP US); H01L 2224/75251 (2013.01 - EP US); H01L 2224/81121 (2013.01 - EP US); H01L 2224/81191 (2013.01 - EP US); H01L 2224/81203 (2013.01 - EP US); H01L 2224/81205 (2013.01 - EP US); H01L 2224/81206 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/30105 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US)
Citation (search report)
- [YA] US 5341979 A 19940830 - GUPTA DEBABRATA [US]
- [A] US 5230458 A 19930727 - ASANASAVEST CHAINARONG [MY]
- [A] US 5493775 A 19960227 - DAREKAR VIJAY S [US], et al
- [A] US 5655700 A 19970812 - PHAM CUONG VAN [US], et al
- [A] EP 0638926 A1 19950215 - FUJITSU LTD [JP]
- [A] US 5199628 A 19930406 - HOMMA YASUAKI [JP]
- [Y] DD 217088 A1 19850102 - ADW DDR [DD]
- [YA] PATENT ABSTRACTS OF JAPAN vol. 096, no. 005 31 May 1996 (1996-05-31)
- [A] DATABASE WPI Section EI Week 8525, Derwent World Patents Index; Class S01, AN 85-151729, XP002115747
- [A] PATENT ABSTRACTS OF JAPAN vol. 097, no. 006 30 June 1997 (1997-06-30)
- [A] PATENT ABSTRACTS OF JAPAN vol. 015, no. 330 (E - 1103) 22 August 1991 (1991-08-22)
Designated contracting state (EPC)
DE FI GB
DOCDB simple family (publication)
EP 0949670 A2 19991013; EP 0949670 A3 19991117; EP 0949670 B1 20050622; DE 69925878 D1 20050728; DE 69925878 T2 20060511; DE 69928457 D1 20051222; DE 69928457 T2 20060727; DE 69930433 D1 20060511; DE 69930433 T2 20061207; EP 1469319 A1 20041020; EP 1469319 B1 20060322; EP 1486790 A1 20041215; EP 1486790 B1 20051116; JP 3176580 B2 20010618; JP H11297761 A 19991029; TW 526688 B 20030401; US 6543668 B1 20030408
DOCDB simple family (application)
EP 99106876 A 19990407; DE 69925878 T 19990407; DE 69928457 T 19990407; DE 69930433 T 19990407; EP 04017117 A 19990407; EP 04017118 A 19990407; JP 9733598 A 19980409; TW 88105036 A 19990330; US 28763999 A 19990407