Global Patent Index - EP 1470892 A1

EP 1470892 A1 20041027 - Polishing pad and method of polishing a semiconductor wafer

Title (en)

Polishing pad and method of polishing a semiconductor wafer

Title (de)

Schleifkissen und Verfahren zum Polieren einer Halbleiterplatte

Title (fr)

Tampon de polissage et procédé de polissage d'une plaquette de semi-conductrice

Publication

EP 1470892 A1 20041027 (EN)

Application

EP 04009441 A 20040421

Priority

JP 2003117538 A 20030422

Abstract (en)

A polishing pad (1) comprises a polishing substrate (11) having a through-hole extending from its polishing surface to the opposite surface, and a light-transmitting member (2) arranged in the through hole. The light-transmitting member is fixed in the through-hole by bonding its outer wall to the inner wall of through-hole with a photocured adhesive layer (3). Independent claims are also included for: (1) a polishing pad laminate comprising the above polishing pad, and a base layer having light transmission properties formed on the surface opposite to the polishing surface of polishing pad; and (2) a method of polishing a semiconductor wafer with the above polishing pad or polishing pad laminate, where the polishing end point of semiconductor wafer is detected by an optical end-point detection device through the light transmitting member of polishing pad or polishing pad laminate.

IPC 1-7

B24B 37/04; B24D 7/12

IPC 8 full level

H01L 21/304 (2006.01); B24B 37/20 (2012.01); B24D 13/14 (2006.01)

CPC (source: EP KR US)

A61J 11/0035 (2013.01 - KR); A61J 11/006 (2013.01 - KR); A61J 11/007 (2013.01 - KR); B24B 37/205 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

DE FR IT

DOCDB simple family (publication)

EP 1470892 A1 20041027; CN 1569398 A 20050126; KR 20040093402 A 20041105; TW 200510470 A 20050316; US 2004224611 A1 20041111

DOCDB simple family (application)

EP 04009441 A 20040421; CN 200410038714 A 20040422; KR 20040026952 A 20040420; TW 93111148 A 20040421; US 82744704 A 20040420