EP 1470892 A1 20041027 - Polishing pad and method of polishing a semiconductor wafer
Title (en)
Polishing pad and method of polishing a semiconductor wafer
Title (de)
Schleifkissen und Verfahren zum Polieren einer Halbleiterplatte
Title (fr)
Tampon de polissage et procédé de polissage d'une plaquette de semi-conductrice
Publication
Application
Priority
JP 2003117538 A 20030422
Abstract (en)
A polishing pad (1) comprises a polishing substrate (11) having a through-hole extending from its polishing surface to the opposite surface, and a light-transmitting member (2) arranged in the through hole. The light-transmitting member is fixed in the through-hole by bonding its outer wall to the inner wall of through-hole with a photocured adhesive layer (3). Independent claims are also included for: (1) a polishing pad laminate comprising the above polishing pad, and a base layer having light transmission properties formed on the surface opposite to the polishing surface of polishing pad; and (2) a method of polishing a semiconductor wafer with the above polishing pad or polishing pad laminate, where the polishing end point of semiconductor wafer is detected by an optical end-point detection device through the light transmitting member of polishing pad or polishing pad laminate.
IPC 1-7
IPC 8 full level
H01L 21/304 (2006.01); B24B 37/20 (2012.01); B24D 13/14 (2006.01)
CPC (source: EP KR US)
A61J 11/0035 (2013.01 - KR); A61J 11/006 (2013.01 - KR); A61J 11/007 (2013.01 - KR); B24B 37/205 (2013.01 - EP US)
Citation (search report)
- [Y] US 5893796 A 19990413 - BIRANG MANOOCHER [US], et al
- [Y] US 2002144771 A1 20021010 - KUCZYNSKI JOSEPH PAUL [US]
- [Y] EP 1252973 A1 20021030 - JSR CORP [JP]
- [A] EP 0941806 A2 19990915 - LAM RES CORP [US]
Designated contracting state (EPC)
DE FR IT
DOCDB simple family (publication)
EP 1470892 A1 20041027; CN 1569398 A 20050126; KR 20040093402 A 20041105; TW 200510470 A 20050316; US 2004224611 A1 20041111
DOCDB simple family (application)
EP 04009441 A 20040421; CN 200410038714 A 20040422; KR 20040026952 A 20040420; TW 93111148 A 20040421; US 82744704 A 20040420