EP 1472727 A2 20041103 - SEMICONDUCTOR COMPONENT COMPRISING A SENSOR SURFACE OR AN ACTUATOR SURFACE, AND METHOD FOR PRODUCING THE SAME
Title (en)
SEMICONDUCTOR COMPONENT COMPRISING A SENSOR SURFACE OR AN ACTUATOR SURFACE, AND METHOD FOR PRODUCING THE SAME
Title (de)
HALBLEITERBAUTEIL MIT SENSOR- BZW. AKTOROBERFLÄCHE UND VERFAHREN ZU SEINER HERSTELLUNG
Title (fr)
COMPOSANT SEMI-CONDUCTEUR PRESENTANT UNE SURFACE DE CAPTEUR OU D'ACTIONNEUR ET PROCEDE POUR LE PRODUIRE
Publication
Application
Priority
- DE 0300334 W 20030206
- DE 10205127 A 20020207
Abstract (en)
[origin: WO03067657A2] The invention relates to an electronic semiconductor component comprising a semiconductor chip (4) having an active chip surface (47) which is bordered by a raised metal frame (45). A plastic housing (10) comprises a recess (63; 102) for the active chip surface (47) within the metal frame (45), leaving said chip surface free. The invention also relates to a method for producing the inventive electronic semiconductor component.
IPC 1-7
H01L 23/31; H01L 21/56; G01D 11/24; B81B 7/00; H01L 31/0203; G01L 9/00
IPC 8 full level
B81B 7/00 (2006.01); G01D 11/24 (2006.01); G01L 9/00 (2006.01); H01L 31/0203 (2006.01)
CPC (source: EP US)
B81B 7/0077 (2013.01 - EP US); G01D 11/245 (2013.01 - EP US); G01L 19/0069 (2013.01 - EP US); G01L 19/147 (2013.01 - EP US); H01L 31/0203 (2013.01 - EP US); H01L 2224/16245 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2924/1815 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US)
Citation (search report)
See references of WO 03067657A2
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR
DOCDB simple family (publication)
WO 03067657 A2 20030814; WO 03067657 A3 20031113; DE 10205127 A1 20030828; EP 1472727 A2 20041103; US 2005046044 A1 20050303; US 6987312 B2 20060117
DOCDB simple family (application)
DE 0300334 W 20030206; DE 10205127 A 20020207; EP 03706288 A 20030206; US 91204504 A 20040806