EP 1475463 A3 20060412 - Reverse pulse plating composition and method
Title (en)
Reverse pulse plating composition and method
Title (de)
Zusammensetzung und Methode zum Elektroplattieren mit Umkehrpulsstrom
Title (fr)
Composition et méthode pour placage électrolytique utilisant de courant pulsé inversé
Publication
Application
Priority
US 43597602 P 20021220
Abstract (en)
[origin: EP1475463A2] A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
IPC 8 full level
C25D 3/02 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP KR US)
C25D 3/02 (2013.01 - EP KR US); C25D 3/38 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US)
Citation (search report)
- [X] WO 0044042 A1 20000727 - ATOTECH DEUTSCHLAND GMBH [DE], et al
- [XY] US 4975159 A 19901204 - DAHMS WOLFGANG [DE]
- [Y] WO 0121294 A2 20010329 - SEMITOOL INC [US], et al
- [X] EP 0440027 A2 19910807 - SHIPLEY CO [US]
- [PX] WO 03080896 A1 20031002 - TASKEM INC [US]
- [A] US 2002130046 A1 20020919 - CHEUNG ROBIN [US], et al
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
DOCDB simple family (publication)
EP 1475463 A2 20041110; EP 1475463 A3 20060412; EP 1475463 B1 20110330; EP 1475463 B2 20170301; CN 1540040 A 20041027; CN 1540040 B 20120404; DE 60336539 D1 20110512; JP 2004204351 A 20040722; JP 4342294 B2 20091014; KR 101085005 B1 20111121; KR 20040055684 A 20040626; TW 200424330 A 20041116; TW I296014 B 20080421; US 2005016858 A1 20050127; US 2006081475 A1 20060420
DOCDB simple family (application)
EP 03258024 A 20031218; CN 200310124974 A 20031219; DE 60336539 T 20031218; JP 2003423400 A 20031219; KR 20030093625 A 20031219; TW 92136071 A 20031219; US 29004005 A 20051130; US 74190803 A 20031219