EP 1475463 B2 20170301 - Reverse pulse plating method
Title (en)
Reverse pulse plating method
Title (de)
Methode zum Elektroplattieren mit Umkehrpulsstrom
Title (fr)
Méthode pour placage électrolytique utilisant du courant pulsé inversé
Publication
Application
Priority
US 43597602 P 20021220
Abstract (en)
[origin: EP1475463A2] A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces.
IPC 8 full level
C25D 3/02 (2006.01); C25D 3/38 (2006.01); C25D 5/18 (2006.01); C25D 7/00 (2006.01)
CPC (source: EP KR US)
C25D 3/02 (2013.01 - EP KR US); C25D 3/38 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US)
Citation (opposition)
Opponent :
- US 6071398 A 20000606 - MARTIN JAMES L [US], et al
- US 2001015321 A1 20010823 - REID JONATHAN D [US], et al
- US 4666567 A 19870519 - LOCH DAVID M [US]
- EP 0785297 B1 20000105 - ATOTECH DEUTSCHLAND GMBH [DE]
- US 5433840 A 19950718 - DAHMS WOLFGANG [DE], et al
- EP 1054080 A2 20001122 - SHIPLEY CO LLC [US]
- EP 1069212 A1 20010117 - APPLIED MATERIALS INC [US]
- EP 1132500 A2 20010912 - APPLIED MATERIALS INC [US]
- US 6210555 B1 20010403 - TAYLOR E JENNINGS [US], et al
- US 5486280 A 19960123 - BULLOCK IV JONATHAN S [US], et al
- US 6099711 A 20000808 - DAHMS WOLFGANG [DE], et al
- WO 0129878 A2 20010426 - FARADAY TECHNOLOGY INC [US]
- PUIPPE J.C. ET AL.: "Theory and Practice of Pulse Plating", 1986, THE AMERICAN ELECTROPLATERS AND SURFACE FINISHERS SOCIETY, ORLANDO, pages: 1-17 - 221
- VAN DER MEULEN P.A. ET AL: "A Study of Whisker Formation in the Electrodeposition of Copper", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 109, no. 7, July 1958 (1958-07-01), pages 300 - 391-395
- SCHLESINGER M. ET AL: "Modern Electroplating", vol. 4, 2000, JOHN WILEY & SONS, NEW YORK, pages: 81-84 - 99-100
- http://groups.molbiosci.northwestern.edu/holmgren/Glossary/Definitions/Def-P/parts per million.html.
- "The International System of Units (SI)", BUREAU INTERNATIONAL DES POIDS ET MESURES, vol. 8, 2006, pages 133 - 135
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1475463 A2 20041110; EP 1475463 A3 20060412; EP 1475463 B1 20110330; EP 1475463 B2 20170301; CN 1540040 A 20041027; CN 1540040 B 20120404; DE 60336539 D1 20110512; JP 2004204351 A 20040722; JP 4342294 B2 20091014; KR 101085005 B1 20111121; KR 20040055684 A 20040626; TW 200424330 A 20041116; TW I296014 B 20080421; US 2005016858 A1 20050127; US 2006081475 A1 20060420
DOCDB simple family (application)
EP 03258024 A 20031218; CN 200310124974 A 20031219; DE 60336539 T 20031218; JP 2003423400 A 20031219; KR 20030093625 A 20031219; TW 92136071 A 20031219; US 29004005 A 20051130; US 74190803 A 20031219